Embedded circuit board and manufacturing method thereof

A circuit board and embedded technology, applied in the direction of circuit, printed circuit, printed circuit, etc., can solve the problems of high processing difficulty, low BT heat dissipation coefficient, and inability to provide heat dissipation effect, etc., and achieve the goal of reducing processing difficulty and high heat dissipation performance Effect

Active Publication Date: 2011-12-28
SKY CHIP INTERCONNECTION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the packaging substrate commonly used in the field of embedded circuit boards is made of bismaleimide triazine resin (Bismaleimide Triazine, BT), and the heat dissipation coefficient of BT is very low, which cannot provide good heat diss

Method used

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  • Embedded circuit board and manufacturing method thereof
  • Embedded circuit board and manufacturing method thereof
  • Embedded circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0016] An embodiment of the present invention provides an embedded circuit board. The copper-clad ceramic base circuit board has high heat dissipation performance and low processing difficulty. Embodiments of the present invention also provide corresponding manufacturing methods. Each will be described in detail below.

[0017] Please refer to figure 1 , an embodiment of the present invention provides an embedded circuit board, including:

[0018] The copper-clad ceramic substrate 100 , the tank body 200 set on the copper-clad ceramic substrate 100 , and the electronic device 300 fixed in the tank body 200 .

[0019] The copper-clad ceramic substrate 100 may be a single-sided copper-clad laminate or a double-sided copper-clad laminate, including a ceramic insulating layer 110 and a metal layer 120 disposed on at least one surface of the ceramic insulating layer 110 . If it is a double-sided copper clad laminate, the metal layer 120 includes: a first metal layer 121 disposed...

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PUM

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Abstract

The invention discloses an embedded-type circuit board, which comprises a copper-clad ceramic substrate, a groove body and an electronic part, wherein the copper-clad ceramic substrate comprises a ceramic insulation layer and a first metal layer which is arranged on the first surface of the ceramic insulation layer; the groove body is arranged on the first metal layer; and the electronic part is fixed inside the groove body. The invention also provides a production method of the embedded-type circuit board. In the invention, the groove body is arranged on the metal layer of the copper-clad ceramic substrate rather than being arranged on the ceramic insulation layer, so that the electronic part can be embedded in the groove body, so the processing difficulty is reduced, and the high heat radiation performance of the copper-clad ceramic substrate can be utilized.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a copper-clad ceramic substrate embedded circuit board and a manufacturing method thereof. Background technique [0002] With the increasing amount of information processing of various electronic devices, the demand for high-frequency and high-speed signal transmission is increasing. Embedding electronic devices into packaging substrates to make embedded circuit boards can effectively shorten the connection distance between electronic devices and packaging substrates, and provide a strong guarantee for high-frequency and high-speed signal transmission. Embedded circuit boards can also meet the development needs of high integration of packages and miniaturization of electronic products. [0003] Heat dissipation is a key issue to be solved by embedded circuit boards. However, the packaging substrate commonly used in the field of embedded circuit boards is made of bismalei...

Claims

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Application Information

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IPC IPC(8): H05K1/18H05K3/30
CPCH01L23/13H05K1/0306H01L23/3735H05K2201/10166H01L2924/0002H05K2201/09745H05K1/183H01L2924/00
Inventor 霍如肖谷新
Owner SKY CHIP INTERCONNECTION TECH CO LTD
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