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Epoxy resin, epoxy resin composition, and cured object

A technology of epoxy resin and composition, which is applied in the field of epoxy resin composition and cured product, epoxy resin, and can solve the problems of improving the physical properties of the cured product

Active Publication Date: 2013-08-07
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, it is a well-known fact that reducing the remaining raw materials can improve the physical properties of the cured product

Method used

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  • Epoxy resin, epoxy resin composition, and cured object
  • Epoxy resin, epoxy resin composition, and cured object
  • Epoxy resin, epoxy resin composition, and cured object

Examples

Experimental program
Comparison scheme
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Embodiment

[0052] Next, in order to clarify the characteristics of the present invention, examples will be given and described in detail. In addition, all of "part" and "%" in the text represent a weight basis.

Synthetic example 1

[0054] In a 3L reactor, 300 parts of divinylbenzene (DVB-960 made by Nippon Steel Chemical Co., Ltd. has a divinylbenzene content of 97%, m-body / p-body=62:38), 1200 parts of ethyl acetate, and Stir. Next, 1640 parts of ethyl acetate solutions containing 30% peracetic acid were dripped over 3 hours. During the dropwise addition, the reaction temperature was controlled to be 30°C. After the dropwise addition, stirring was further performed at 30° C. for 3 hours. After cooling the reaction solution to room temperature, 1208 parts of 20% NaOH aqueous solution was added, and after stirring for 1 hour, the water layer was separated to remove unreacted peracetic acid and produced acetic acid. Ethyl acetate was distilled off under reduced pressure with an evaporator, and then refined distillation was performed (distillation temperature: 10 torr, 150° C.) to obtain 151.6 parts of diexiranylbenzene. The epoxy equivalent of the epoxyethylbenzene that obtains is 81g / eq, and the viscosi...

Embodiment 1

[0056] In a detachable flask equipped with a stirrer, a condenser, and a thermometer, 61 parts of diexiranylbenzene produced in Synthesis Example 1, 41 parts of bisphenol A (manufactured by Tokyo Chemical Industry Co., Ltd.), 102 parts of Methyl isobutyl ketone (manufactured by Tokyo Chemical Industry Co., Ltd.) was heated to 80°C and completely dissolved under stirring, then 0.07 parts of triphenylphosphine was added as a catalyst, the temperature was raised to 130°C, and the reaction was carried out for 6 hours. After completion of the reaction, devolatilization was performed at 120° C. under a reduced pressure of 5 torr. 100 parts of epoxy resin (A) which is a light yellow transparent viscous liquid with an epoxy equivalent of 259 g / eq was obtained. The total chlorine content measured by the oxygen bomb combustion method (Bonbe combustion method) is less than 0.5ppm. The 1H-NMR spectrum of epoxy resin (A) is shown in figure 1 .

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Abstract

An epoxy resin which has a low chlorine content, excellent heat resistance, and excellent mechanical strength and is useful in coating materials, laminates, adhesives, etc.; an epoxy resin composition; and a cured object. The epoxy resin is an epoxy resin which is obtained by reacting diepoxyethylbenzene with a compound having two phenolic hydroxy groups and is represented by formula (1), or comprises the epoxy resin as the main component. In formula (1), A is a residue derived from a compound having two phenolic hydroxy groups. The epoxy resin composition comprises the epoxy resin and a hardener.

Description

technical field [0001] The present invention relates to epoxy resins, epoxy resin compositions, and cured products useful for coatings, laminates, adhesives, and the like. Background technique [0002] For a long time, epoxy resins used in coatings, laminates, adhesives, etc. have low epoxy equivalents, and poor adhesion and toughness of cured products. Therefore, bisphenol A, bisphenol F or tetrabromobisphenol are generally used A, etc. are so-called high-molecular epoxy resins in which bisphenol A-type epoxy resin or bisphenol F-type epoxy resin is polymerized. [0003] However, although this polymeric epoxy resin is superior in adhesiveness to liquid resins, it has disadvantages in that it is inferior in heat resistance and mechanical strength. As a countermeasure against this disadvantage, Patent Document 1 discloses a method in which an alkali metal compound and imidazoles are used together as a catalyst, a solvent having a boiling point of 130° C. or higher is used as...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/06C08G59/20
CPCC08G59/066C08G59/027
Inventor 片山笃彦N·K·施雷斯塔
Owner NIPPON STEEL CHEM &MATERIAL CO LTD