High-power light-emitting diode (LED) with cooling substrate made of diamond powder-copper powder composite
A technology of light-emitting diodes and heat-dissipating substrates, applied in the field of LED invention, can solve problems such as heat dissipation of LED chips, and achieve the effects of improving heat transfer efficiency, enhancing heat dissipation effect, and increasing contact area.
Inactive Publication Date: 2012-02-01
SOUTH CHINA NORMAL UNIVERSITY
View PDF4 Cites 7 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] The technical problem to be solved by the present invention is to overcome the heat dissipation problem of the existing LED chip, and provide a high-power light-emitting diode with diamond powder-copper powder composite material as a heat dissipation substrate
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0031] See figure 1 As shown in FIG. 4, the present invention provides a preferred embodiment of a high-power LED packaging structure using a diamond powder-copper powder composite material as a heat dissipation substrate, but the implementation and protection scope of the present invention are not limited to this.
[0032] Such as figure 1 Shown: the upper surface of the heat dissipation substrate 11 made of diamond powder and copper powder composite material has a pit 112 in the center. The LED chip 6 is directly placed on the bottom surface of the pit 112 through the bonding glue 4, and the pit 112 is equivalent to a reflective cup There are highly reflective materials on the surface of the pit 112, such as polymer, metallic silver, aluminum, etc., to emit the lateral light of the LED chip 6. The pits are filled with an elastic transparent substance 8. Silica gel is usually used. Silica gel has many advantages. It has a large refractive index; it does not turn yellow; it remain...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a high-power light-emitting diode (LED) with a cooling substrate made of a diamond powder-copper powder composite, and the LED provided by the invention comprises an LED chip, a lens and the cooling substrate made of the diamond powder-copper powder composite, wherein the lower surface of the cooling substrate is directly contacted with the air, the upper surface of the cooling substrate is provided with a concave pit, and the LED chip is directly placed at the bottom of the concave pit on the upper surface of the cooling substrate by using a solid crystal adhesive or through metal eutectic soldering; the inside of the concave pit is filled with an insulating elastic transparent substance, and the insulating elastic transparent substance covers the whole LED chip and leading wires thereof; and the lens covers the concave pit. The composite can extract heat from the high-power LED according to the shortest path and directly discharge heat to the air. Because thethermal conductivity of the composite is large, through combining with an optimized structure design, the composite can be used for cooling a single high-power LED and an LED module, thereby achieving the purpose of enhancing the light output power and prolonging the service life of the LED.
Description
Technical field [0001] The present invention relates to the technical field of LED inventions, in particular, to a high-power LED that directly uses a diamond powder-copper powder composite material as a heat dissipation substrate. Background technique [0002] In the past when LEDs could only be used as status indicators, the heat dissipation of the package has never been a problem. However, in recent years, the brightness and power of LEDs have been actively improved, and they have begun to be used in backlight and electronic invention applications. The problem has arisen. If a doubled current is fed into the same single package, the heat will naturally be doubled, so the heat dissipation will of course deteriorate. For example, because white LEDs are used as flashlights for camera phones, light bulbs for small inventions, and light bulbs for projectors, high brightness is not enough, and high power is needed. Heat dissipation becomes a problem at this time. What's more, in ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H01L33/64H01L33/48H01L33/60
CPCH01L2924/181H01L2224/48091H01L2224/48137H01L2224/73265H01L2924/00014H01L2924/00012
Inventor 姚光锐范广涵郑树文张涛周德涛赵芳宋晶晶
Owner SOUTH CHINA NORMAL UNIVERSITY