Light emitting device and manufacturing method thereof
A technology for light-emitting devices and light-emitting elements, which is applied to electrical components, electric solid-state devices, circuits, etc., can solve the problems of large deviation of chromaticity, difficulty in manufacturing light-emitting devices with high efficiency, and achieve the effect of high light-emitting efficiency.
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no. 1 Embodiment approach
[0035] figure 1 (a) shows a sectional view of the light emitting device of the first embodiment, figure 1 (b) and (c) show top views. like figure 1 As shown in (a), the flip-chip light-emitting element 11 is bonded to the sub-mount substrate 10 on which wiring is formed on the upper surface through a plurality of bumps 12, thereby completing the mounting. A wavelength conversion layer 13 is mounted on the upper surface of the light emitting element 11 , and a transparent plate member 14 is mounted on the wavelength conversion layer 13 .
[0036] In the base material of the wavelength conversion layer 13 , phosphor particles 13 a are distributed at a high concentration, and spacers 13 b are scattered therein. A material transparent to the light emitted by the light emitting element 11 and the fluorescence emitted by the phosphor particles 13 a excited by the light emitted by the light emitting element 11 is used as the base material. The substrate may be an organic material...
no. 2 Embodiment approach
[0059] Image 6 It is a cross-sectional view showing the light-emitting production of the second embodiment. In order to further improve the light extraction efficiency of this light-emitting device, it is configured that the reflective material layer 15 is filled with the light in the first embodiment. image 3 The gap on the lower surface of the light emitting element 11 of the light emitting device. In addition, the reflective material layer 15 also covers the side surfaces of the light emitting element 11 , the wavelength converting layer 13 and the transparent plate member 14 .
[0060] Specifically, a frame 16 is disposed outside the light emitting element 11 , and the space between the light emitting element 11 and the frame 16 is filled with the reflective material layer 15 . The reflective material layer 15 uses a non-conductive material with high reflectivity. The reflective material layer 15 covers the outer peripheral sides of the light emitting element 11 , the...
no. 3 Embodiment approach
[0070] Next, a light-emitting device in which a plurality of light-emitting elements 11 are mounted on one submount substrate 10 in the first embodiment will be described. Figure 8 (a), (b), and (c) show cross-sectional views of the light emitting device of the third embodiment.
[0071] The plurality of light emitting elements 11 are mounted as a whole so as to be covered by one transparent plate member 14 . The intervals between the plurality of light emitting elements 11 and the transparent plate-like member 14 are determined by the spacer 13b interposed therebetween. A thinner wavelength conversion layer 13 is formed between the light emitting element 11 and the transparent plate member 14 .
[0072] The heights of the upper surfaces of the plurality of light emitting elements 11 may vary due to errors in mounting the plurality of light emitting elements 11 on the submount substrate 10 . At this time, when one transparent plate-shaped member 14 is attached to the whole ...
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