Manufacturing Method Of Photosensitive Resin Composition And Solidified Embossing Pattern, And Semiconductor Device

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve problems such as discoloration of copper or copper alloy

Active Publication Date: 2012-03-14
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the conventional photosensitive resin composition, since the compound in the composition easily reacts with copper or copper alloy, there is a problem of discoloration of copper or copper alloy.

Method used

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  • Manufacturing Method Of Photosensitive Resin Composition And Solidified Embossing Pattern, And Semiconductor Device
  • Manufacturing Method Of Photosensitive Resin Composition And Solidified Embossing Pattern, And Semiconductor Device
  • Manufacturing Method Of Photosensitive Resin Composition And Solidified Embossing Pattern, And Semiconductor Device

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0084] (Preparation of acid / ester body)

[0085] In the present invention, a tetravalent organic group X that can be suitably used to prepare an ester-bonded polyimide precursor 1 Examples of the tetracarboxylic dianhydride include pyromellitic anhydride, diphenyl ether-3,3',4,4'-tetracarboxylic dianhydride, and benzophenone-3,3',4,4 '-Tetracarboxylic dianhydride, biphenyl-3,3',4,4'-tetracarboxylic dianhydride, diphenylsulfone-3,3',4,4'-tetracarboxylic dianhydride, two Phenylmethane-3,3',4,4'-tetracarboxylic dianhydride, 2,2-bis(3,4-phthalic anhydride)propane, 2,2-bis(3,4-phthalic anhydride) Dicarboxylic acid anhydride)-1,1,1,3,3,3-hexafluoropropane, etc., but it is not limited to these. In addition, of course, these can be used individually, and 2 or more types can also be mixed and used for it.

[0086] In the present invention, as alcohols having photopolymerizable unsaturated double bonds that can be suitably used to prepare ester-bonded polyimide precursors, for example, 2-a...

Embodiment

[0313] Hereinafter, the present invention will be specifically explained through examples, but the present invention is not limited to these. In the examples, comparative examples, and production examples, the physical properties of the photosensitive resin composition were measured and evaluated in accordance with the following methods.

[0314] (1) Weight average molecular weight

[0315] The weight average molecular weight (Mw) of each resin was measured by gel permeation chromatography (standard polystyrene conversion). The column used in the measurement is the brand name "Shodex 805M / 806M tandem" manufactured by Showa Denko Corporation, the standard monodisperse polystyrene is selected as the brand name "Shodex STANDARD SM-105" manufactured by Showa Denko Corporation, and the developing solvent is For N-methyl-2-pyrrolidone, the detector uses the trade name "Shodex RI-930" manufactured by Showa Denko Corporation.

[0316] (2) Copper discoloration test

[0317] The photosensitiv...

manufacture example 1

[0344] (Synthesis of polymer A as (A) polyimide precursor)

[0345] Put 155.1g 4,4'-oxydiphthalic dianhydride (ODPA) into a 2L separable flask, add 131.2g 2-hydroxyethyl methacrylate (HEMA) and 400ml γ-butane The ester was stirred at room temperature, and 81.5 g of pyridine was added while stirring to obtain a reaction mixture. After the exotherm caused by the reaction is over, it is naturally cooled to room temperature and left for 16 hours.

[0346] Next, under ice cooling, a solution obtained by dissolving 206.3 g of dicyclohexylcarbodiimide (DCC) in 180 ml of γ-butyrolactone was added to the reaction mixture while stirring for 40 minutes, and then added over 60 minutes while stirring A solution prepared by suspending 93.0 g of 4,4'-diaminodiphenyl ether (DADPE) in 350 ml of γ-butyrolactone. After further stirring for 2 hours at room temperature, 30 ml of ethanol was added and stirred for 1 hour, and then 400 ml of γ-butyrolactone was added. The precipitate generated in the ...

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PUM

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Abstract

The invention provides a manufacturing method of photosensitive resin composition capable of forming a solidifying film causing no color change even on copper or copper alloy. The invention also provides a manufacturing method of a solidified embossing pattern by adopting the photosensitive resin composition to form pattern, and a semiconductor device. The photosensitive resin composition includes by mass: (A) 100 parts of at least one resin selected from a group formed by polyamide acid and polyamide acid esters as polyimide precursor, and poly oxyamide, poly amino acid amide, polyamide, polyamide imide, polyimide, polybenzoxazole, imidite and polybenzothiazole as poly oxazole precursor; (B) 0.01 to 10 parts of purine derivatives; and (C) 1 to 50 parts of sensitizer.

Description

Technical field [0001] The present invention relates to a photosensitive resin composition, a method for manufacturing a cured relief pattern using the same, and a semiconductor device, the photosensitive resin composition being used to form, for example, insulating materials for electronic parts and passivation films and buffer coating films in semiconductor devices And relief patterns such as interlayer insulating film. Background technique [0002] Conventionally, polyimide resins having excellent heat resistance, electrical properties, and mechanical properties have been used for insulating materials of electronic components, passivation films of semiconductor devices, surface protective films, interlayer insulating films, and the like. Among the polyimide resins, a substance provided in the form of a photosensitive polyimide precursor can be easily formed by thermal imidization treatment of coating, exposure, development, and curing of the precursor. Thermal relief pattern ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/00H01L21/312
CPCG03F7/00G03F7/004G03F7/0045G03F7/0047H01L21/027H01L21/0271
Inventor 藤田充森田凉子平田竜也
Owner ASAHI KASEI KK
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