Impedance matching method for gold bonding wire
A technology of gold wire bonding and impedance matching, which is applied in special data processing applications, instruments, electrical digital data processing, etc., can solve problems such as mismatching of gold wire bonding wires, and overcome narrow frequency bandwidth and frequency limitations The effect of small size and wide frequency bandwidth
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[0028] Refer to the attached figure 1 The present invention is further described.
[0029] At present, many circuit simulation software provide very good fast algorithms, model extraction and intuitive operation platforms, such as HFSS, microwave office, Designer, ADS, CST, etc. The embodiment of the present invention adopts microwave circuit simulation design software ADS to establish physical model, equivalent network and design matching network.
[0030] (1) Establish the gold wire bonding model: use ADS to calculate the width of the 50Ohm microstrip line to be 0.386mm, and then establish the left end as the 50Ohm microstrip line and the right end as the 0.1mm microstrip line in the layout (because it can be processed in engineering The thinnest wire is 0.1mm), the distance between the two microstrip lines is 4mil, and the interface between the gold wire and the microstrip line is 1mil, so the length of the gold wire is 6mil .In this model, the gold wire bonding wire adop...
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