Polyamide resin with low softening point and preparation method thereof

A technology of polyamide resin with low softening point, applied in adhesives, etc., can solve the problems of poor low temperature resistance and achieve good high and low temperature resistance and mechanical properties, low water absorption and low viscosity

Inactive Publication Date: 2012-04-04
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the softening point of ordinary polyamide resins on the market is generally greater than 80°C, and the low temperature resistance is poor. There is no report on the polyamide hot melt adhesive with a softening point less than 80°C.

Method used

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  • Polyamide resin with low softening point and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Add 173.00g of hydrogenated dimer acid, 35.89g of polyetheramine D-230, 1.8g of tetrakis[β-(3,5-di-tert-butyl Base-4-hydroxyphenyl)propionic acid]pentaerythritol ester, 1.0g propionic acid, and 8.99g ethylenediamine are packed in the constant-pressure dropping funnel, feed nitrogen and stir to start heating, and the temperature rises within 40 minutes. to 130°C, and at this temperature, slowly drop ethylenediamine, and the dropwise addition is completed within 40 minutes. At this time, the temperature rises to 140°C, and stirs at this temperature for 2 hours, and then slowly increases the temperature. There will be water evaporated, and the temperature will rise to 240°C within 3 hours, keep at this temperature for 2 hours, then use a vacuum pump to vacuum for 2 hours to a pressure of 100Pa, and finally discharge the material under the protection of nitrogen to obtain a light yellow rubber strip.

Embodiment 2

[0029] Add 160.10g of dimer acid, 33.77g of polyetheramine D-230, 56.30g of polyetheramine D-2000, 1.0g of tetra[β -(3,5-di-tert-butyl-4-hydroxyphenyl) propionic acid] pentaerythritol ester, 0.6g phosphite tris(2,4-di-tert-butylphenyl) ester, 1.40g propionic acid, and 6.77 Put ethylenediamine into a constant pressure dropping funnel, feed in nitrogen and stir to start heating, raise the temperature to 130°C within 60 minutes, and slowly add ethylenediamine dropwise at this temperature, and complete the dropwise addition within 60 minutes At this time, the temperature rises to 140°C, and stirs at this temperature for 2 hours, and then slowly raises the temperature. During this process, water will evaporate, and the temperature rises to 280°C within 3 hours, and is kept at this temperature for 5 hours. Then use a vacuum pump to evacuate for 3 hours to a pressure of 200 Pa, and finally discharge under the protection of nitrogen to obtain a light yellow rubber strip.

Embodiment 3

[0031] Add 149.80g of dimer acid, 63.30g of polyetheramine D-400, 52.77g of polyetheramine D-2000, 1.5g of tetra[β -(3,5-di-tert-butyl-4-hydroxyphenyl) propionic acid] pentaerythritol ester, 6.90g stearic acid, and 4.70g ethylenediamine are packed in the constant pressure dropping funnel, feed nitrogen and stir Start heating, raise the temperature to 120°C within 50 minutes, and slowly add ethylenediamine dropwise at this temperature, and complete the dropwise addition within 40 minutes, then the temperature rises to 130°C, and stir at this temperature for 2 hours, Then slowly raise the temperature, water will evaporate during this process, the temperature will rise to 220°C within 2 hours, keep at this temperature for 1 hour, then use a vacuum pump to evacuate for 3 hours to a pressure of 400Pa, and finally leave under the protection of nitrogen. material, a light yellow strip was obtained.

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Abstract

The invention relates to a polyamide resin with low softening point and a preparation method thereof. The polyamide resin is prepared from dimeric acid, fatty group diamine, polyether polyamines, molecular weight conditioning agent and anti-oxidant. The total mol ratio of dimeric acid to fatty group diamine and polyether polyamines is 0.95-1.05; the mol ratio of fatty group diamine to polyether polyamines is 20-60: 40-80; the mol number of molecular weight conditioning agent is 0.1-5% of the total mol number of dimeric acid or fatty group diamine and polyether polyamines, the mass of anti-oxidant is 0.1-2% of the total mass of dimeric acid, fatty group diamine and polyether polyamines. The polyamide resin is prepared from dimeric acid, fatty group diamine, polyether polyamines and anti-oxidant by condensation polymerization, which has the advantages of good resistance to low temperature and lower softening point.

Description

technical field [0001] The invention relates to a polyamide resin with a low softening point and a preparation method thereof, belonging to the field of hot-melt adhesives. Background technique [0002] Polyamide resin is formed by the condensation of dimer acid and diamine or polyamine. It has good adhesion to various polar substrates, has good flexibility, and has a wide range of applications. It is environmentally friendly and solvent-free. Good chemical resistance and excellent molding properties, etc., can be widely used in electronic appliances, automobiles, packaging, machinery and other industries. At present, the softening point of common polyamide resins on the market is generally greater than 80°C, and its low temperature resistance is poor. There is no report on polyamide hot melt adhesives with a softening point less than 80°C. Contents of the invention [0003] Aiming at the deficiencies of the prior art, the present invention provides a polyamide resin with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G69/40C08G69/34C09J177/08
Inventor 白战争王建斌陈田安
Owner YANTAI DARBOND TECH
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