Composition for polyimide resin and polyimide resin comprising same
A technology of polyimide resin and composition, applied in the field of polyimide resin, can solve problems such as the inability to obtain stable black color, and achieve the effect of excellent light-shielding and electrical properties
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Embodiment 1
[0128] Into a 500 L flask was charged 255 g of NMP as a polymerization solvent. Then, 9.4g (0.087mol) p-PDA and 4.3g (0.022mol) 4,4'-DAPE were added as diamine components, and then stirred at 30°C to make the diamine components p-PDA and 4,4 '-DAPE dissolved in NMP.
[0129] 25.6 g (0.087 mol) of BPDA and 4.8 g (0.022 mol) of PMDA as acid anhydride components were slowly added simultaneously to the resulting solution.
[0130] Then, it stirred at room temperature for 10 hours, and obtained the polyamic-acid resin solution. In 100 g of the obtained polyamic acid resin solution, the solid content weight of the polyamic acid was 15 g. Here, the weight of the solid content of the polyamic acid is calculated based on the added mass of the acid anhydride compound, the diamine compound, and the solvent.
[0131] 0.45 g of the perylene black pigment FK4280 which has an isoindole skeleton was added to 100 g of the obtained polyamic-acid resin solution (15 g of solid weight), and it ...
Embodiment 2、3
[0134] A double-layer flexible copper-clad laminate and a black polyimide film were obtained in the same manner as in Example 1 except that the amount of the perylene black pigment having an isoindole skeleton was changed to the amount shown in Table 1.
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