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Composition for polyimide resin and polyimide resin comprising same

A technology of polyimide resin and composition, applied in the field of polyimide resin, can solve problems such as the inability to obtain stable black color, and achieve the effect of excellent light-shielding and electrical properties

Active Publication Date: 2013-03-13
ARISAWA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] When using the organic dyes or organic pigments described in Patent Document 2, the presence of dyes or The problem of pigment decomposition or sublimation leading to inability to obtain a stable black color

Method used

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  • Composition for polyimide resin and polyimide resin comprising same
  • Composition for polyimide resin and polyimide resin comprising same
  • Composition for polyimide resin and polyimide resin comprising same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0128] Into a 500 L flask was charged 255 g of NMP as a polymerization solvent. Then, 9.4g (0.087mol) p-PDA and 4.3g (0.022mol) 4,4'-DAPE were added as diamine components, and then stirred at 30°C to make the diamine components p-PDA and 4,4 '-DAPE dissolved in NMP.

[0129] 25.6 g (0.087 mol) of BPDA and 4.8 g (0.022 mol) of PMDA as acid anhydride components were slowly added simultaneously to the resulting solution.

[0130] Then, it stirred at room temperature for 10 hours, and obtained the polyamic-acid resin solution. In 100 g of the obtained polyamic acid resin solution, the solid content weight of the polyamic acid was 15 g. Here, the weight of the solid content of the polyamic acid is calculated based on the added mass of the acid anhydride compound, the diamine compound, and the solvent.

[0131] 0.45 g of the perylene black pigment FK4280 which has an isoindole skeleton was added to 100 g of the obtained polyamic-acid resin solution (15 g of solid weight), and it ...

Embodiment 2、3

[0134] A double-layer flexible copper-clad laminate and a black polyimide film were obtained in the same manner as in Example 1 except that the amount of the perylene black pigment having an isoindole skeleton was changed to the amount shown in Table 1.

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Abstract

A composition for a polyimide resin, comprising a polyamic acid and a perylene black pigment having an isoindole skeleton, wherein a content of the perylene black pigment is 1 to 10% by mass based on 100% by mass of a weight of a solid content of the polyamic acid.

Description

technical field [0001] The present invention relates to a novel polyimide resin composition, a polyimide resin composed of the polyimide resin composition, a metal-clad laminate, a cover layer, and a flexible printed wiring board . Background technique [0002] In the prior art, a resin layer such as polyimide film or polyamide film with electrical insulation, an adhesive layer mainly composed of epoxy resin or polyimide resin, and a conductive copper foil, Flexible printed wiring boards (FPC) such as cover layers or metal-clad laminates made of appropriate combinations of metal foil layers such as silver foil and aluminum foil. [0003] Known metal-clad laminates include a three-layer flexible metal laminate composed of a metal layer, a polyimide layer, and an adhesive layer such as epoxy resin, and a double-layer flexible metal laminate composed of a metal layer including a metal foil and a polyimide layer. ply flexible metal laminate. [0004] Recently, flexible metal ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08B32B15/088B32B27/34C08K5/3447H05K1/03
CPCB32B2307/41C08L79/08C08K5/3447B32B2307/734B32B2250/03B32B2250/02B32B2307/204B32B15/20H05K1/0346B32B2457/08B32B15/08B32B2307/20B32B27/20C08K5/0041B32B2307/202B32B2307/3065H05K2201/0154B32B27/281Y10T428/287Y10T428/28Y10T428/2878Y10T428/2887Y10T428/12569Y10T428/2891Y10T428/2896Y10T428/31721Y10T428/31681C08G73/10
Inventor 松山浩幸田井诚岩野畅行
Owner ARISAWA MFG CO LTD