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Ammonia-free phenolic molding compound and its preparation method

A molding compound, aminophenol technology, applied in the field of phenolic molding compound and its preparation, can solve the problems of low shrinkage and dimensional stability, inability to achieve heat resistance, ammonia gas release, etc., achieve low dimensional stability, high mechanical strength, The effect of low molding shrinkage

Inactive Publication Date: 2012-04-11
WUXI CHUANGDA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The disadvantage of such phenolic molding compound is that it can no longer meet the requirements of heat resistance, high strength, low shrinkage and dimensional stability, and ammonia gas is released during production and molding, which pollutes the environment.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] a. Pulverize the phenolic resin into a fine powder smaller than 20 mesh;

[0026] b. Add 100 parts of pulverized phenolic resin, 30 parts of kaolin, 170 parts of glass fiber, 5 parts of stearic acid, 15 parts of nitrile rubber, and 6 parts of additives into the mixer, and mix them evenly;

[0027] c. Pass the uniformly mixed powder through a heated double-roller or screw machine to melt, knead and knead evenly;

[0028] d. The kneaded and kneaded uniform powder is cooled and crushed, and then passed through a vibrating sieve to form irregular granular solids with a particle size of less than 5mm.

[0029] The amino-free phenolic molding compound of the present invention is obtained through the above preparation steps.

Embodiment 2

[0031] a. Pulverize the phenolic resin into a fine powder smaller than 20 mesh;

[0032] b. Add 100 parts of pulverized phenolic resin, 40 parts of kaolin, 170 parts of glass fiber, 5 parts of stearic acid, 15 parts of nitrile rubber, and 6 parts of additives into the mixer, and mix them evenly;

[0033] c. Pass the uniformly mixed powder through a heated double-roller or screw machine to melt, knead and knead evenly;

[0034] d. The kneaded and kneaded uniform powder is cooled and crushed, and then passed through a vibrating sieve to form irregular granular solids with a particle size of less than 5mm.

[0035] The amino-free phenolic molding compound of the present invention is obtained through the above preparation steps.

Embodiment 3

[0037] a. Pulverize the phenolic resin into a fine powder smaller than 20 mesh;

[0038] b. Add 100 parts of pulverized phenolic resin, 50 parts of kaolin, 170 parts of glass fiber, 5 parts of stearic acid, 15 parts of nitrile rubber, and 6 parts of additives into the mixer, and mix them evenly;

[0039] c. Pass the uniformly mixed powder through a heated double-roller or screw machine to melt, knead and knead evenly;

[0040] d. The kneaded and kneaded uniform powder is cooled and crushed, and then passed through a vibrating sieve to form irregular granular solids with a particle size of less than 5mm.

[0041] The amino-free phenolic molding compound of the present invention is obtained through the above preparation steps.

[0042] The characteristic evaluation form is as follows:

[0043] Example 1 Example 2 Example 3 Bending strength MPa 180 185 180 Flexural modulus GPa 17．5 18 19.5 Molding shrinkage % 0.04 0.03 0.02 Heat di...

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PUM

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Abstract

The invention discloses an ammonia-free phenolic molding compound and its preparation method. The compound is composed of the following raw materials: 100 parts of phenolic resin, 30-50 parts of kaolin, 140-180 parts of glass fiber, 3-8 parts of eleaostearic acid, 10-20 parts of nitrile-butadiene rubber, and optionally a small amount of a curing accelerator, a pigment and other auxiliary agents. The preparation method consists of: mixing the above components uniformly and conducting heating melting, kneading, mixing and crushing, thus obtaining the ammonia-free phenolic molding compound in irregular particles. The ammonia-free phenolic molding compound prepared by the invention has good heat resistance, high mechanical strength, low molding shrinkage, and dimensional stability, and also has no ammonia gas release during production and compression molding, thus being environment-friendly.

Description

technical field [0001] The invention relates to a phenolic molding compound and a preparation method thereof, in particular to an amino-free phenolic molding compound with high strength, high heat resistance and low molding shrinkage applied in the electronics and automobile industries and a preparation method thereof. Background technique [0002] Among the current electronic and automobile industry materials, phenolic molding compound has a wide range of uses, and it is mainly made of phenolic plastics filled with wood powder after pressing, commonly known as bakelite powder. [0003] The disadvantage of such phenolic molding compound is that it can no longer meet the requirements of heat resistance, high strength, low shrinkage and dimensional stability, and ammonia gas is released during the production and molding process, which pollutes the environment. Contents of the invention [0004] The object of the present invention is to provide a kind of amino-free phenolic m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/10C08L9/02C08K13/04C08K7/14C08K3/36C08K5/098B29B7/00B29B13/10
Inventor 翁根元
Owner WUXI CHUANGDA ELECTRONICS
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