LED packaging material, preparation method and application thereof

A technology for LED packaging and phosphor powder, which is applied to electrical components, circuits, semiconductor devices, etc., can solve the problems of long mixing time, complex process and high cost, and achieve the effects of short mixing time, simple processing technology and easy packaging operation.

Active Publication Date: 2012-05-09
厦门市华海光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the fluorescent powder used for LED packaging materials is mostly made of ball mill. This kind of fluorescent powder is easy to precipitate and precipitate from the fluorescent slurry when coating, resulting in uneven coating and easy to cause white light tones drift. Makes the color of LEDs appear blue or yellow
Moreover, since the particle size distribution of the phosphor powder produced by the existing ball mill is wide, the appearance is irregular, and it is easy to aggregate, which makes it necessary to place the corundum beads in the ball mill and mix them for at least 2 hours when preparing the packaging material. After drying, the dried composite powder needs to be sieved, followed by high-temperature hot pressing, sintering, etc., and finally the sintered body must be ground and polished to complete the preparation. For details, please refer to the application number 200910154360 , The application date is November 30, 2009, the Chin

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] (1) 800g glass powder (light transmittance 85-95%, softening temperature T g 300°C, sintering temperature is 350°C) and 200g phosphor (Y 2 o 3 :Eu red phosphor, BaAl 12 o 19 : Mn blue phosphor, Ce 1-x TbxMgAl 11 o 19 Green fluorescent powder, the mass ratio of the three fluorescent powders is 1:2:3, and the particle size is 0.1-1 μm, and the uniform fluorescent powder is a spherical non-aggregated type) as the starting material, and 250g of absolute ethanol in Stir and mix at a speed of 1800rpm in the mixer to obtain a composite powder;

[0035] (2) filtering the composite powder obtained in step (1), and then drying at 100°C to obtain a composite powder;

[0036] (3) The composite powder obtained in step (2) is placed in a high-temperature and high-pressure mold, and the continuous stamping high-temperature forming technology is adopted, and the specific conditions are: at 200Kg / m 2 Stamping 10 times, after vacuuming and degassing, sintering from room temperatu...

Embodiment 2

[0040] (1) 950g glass powder (light transmittance 85-95%, softening temperature T g 500°C, the sintering temperature is 580°C) and 50g of phosphor (commercially available white aluminum garnet phosphor powder, Y 3 al 5 o 12 :Eu red phosphor, Y 2 SiO 5 : Ce blue phosphor, Y 3 al 5 o 12 : Tb green fluorescent powder, the mass ratio of three fluorescent powders is 1:1:2, and the particle diameter is 2~3 μm, and the fluorescent powder body is spherical non-aggregated type) as starting material, and 430g anhydrous Ethanol is stirred and mixed at a speed of 1300rpm in a mixer to obtain a composite powder;

[0041] (2) Filter the composite powder obtained in step (1), and then dry at 150° C. to obtain a composite powder;

[0042] (3) The composite powder obtained in step (2) is placed in a high-temperature and high-pressure mold, and the continuous stamping high-temperature molding technology is adopted, and the specific conditions are: at 1500Kg / m 2 Stamping 3 times, after ...

Embodiment 3

[0046] (1) 900g glass powder (light transmittance 85-95%, softening temperature T g 420°C, sintering temperature is 450°C) and 100g phosphor (Sr 5 (PO 4 ) 3 Cl:Eu red phosphor, Y 2 SiO 5 : Ce blue phosphor, Y 3 al 5 o 12 : Tb green fluorescent powder, the mass ratio of three kinds of fluorescent powder is 1: 1: 2, and particle diameter is 2~3 μ m, and fluorescent powder body is spherical non-aggregated type) as starting material, and 700g dehydrated alcohol Stir and mix at a speed of 1500rpm in a mixer to obtain a composite powder;

[0047] (2) Filter the composite powder obtained in step (1), and then dry at 120° C. to obtain a composite powder;

[0048] (3) The composite powder obtained in step (2) is placed in a high-temperature and high-pressure mold, and the continuous stamping high-temperature forming technology is adopted, and the specific conditions are: at 1000Kg / m 2 Stamping 5 times, after vacuuming and degassing, sintering from room temperature to sintering...

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Abstract

The present invention discloses a LED packaging material, a preparation method and an application thereof. The LED packaging material comprises, by mass, 80-95% of glass micropowder and 5-20% of phosphor, wherein the phosphor is spherical non-aggregating phosphor. The preparation method comprises: adopting the glass micropowder and the phosphor as starting materials; stirring and mixing the glass micropowder, the phosphor and absolute alcohol to obtain composite powder body; filtering the composite powder body, and drying at a temperature of 100-150 DEG C to obtain the composite powder; placing the composite powder in a high temperature and high pressure grinding tool; adopting a continuous stamping and high temperature forming technology to treat the composite powder; and cooling to the room temperature to obtain the LED packaging material. The LED packaging material has characteristics of good light transmission rate, excellent air impermeability, and good heat dissipation performance so as to protect the use performance of the LED chip.

Description

technical field [0001] The invention particularly relates to an LED encapsulation material and a preparation method and application thereof, belonging to the field of luminescent materials. Background technique [0002] As a new type of lighting source, LED is being more and more widely used in various occasions due to its outstanding advantages such as energy saving, environmental protection, high luminous efficiency, and long life. The application of LEDs in lamps can now be used as large and small lamps such as street lamps and advertising lamps. [0003] LED light-emitting diodes have become a research and application hotspot due to energy saving. The important component in the LED light-emitting diode is the chip. LED packaging refers to the packaging of light-emitting chips. This packaging not only requires protection of the wick, but also transmits light. Therefore, there are special requirements for packaging materials in LED packaging. In the past, LED packaging ...

Claims

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Application Information

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IPC IPC(8): C03C8/24H01L33/56
Inventor 李启智诸平
Owner 厦门市华海光电科技有限公司
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