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Method for preparing osmium membrane through electroplating

A technology of osmium film and electroplating solution, which is applied in the field of preparing osmium film by electroplating method, which can solve the problems that the osmium film is prone to cracking and difficult to meet the requirements of use, and achieve the effect of prolonging the detection life, increasing the working life and not being easy to crack

Inactive Publication Date: 2012-05-16
BEIJING INST OF SPACECRAFT ENVIRONMENT ENG
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Problems solved by technology

Generally, the traditional manufacturing method of osmium film is plasma vapor deposition (PVD method), but the osmium film deposited by PVD method is prone to cracking, which is difficult to meet the requirements of use, and the osmium film needs to reach a certain thickness, such as The thickness reaches more than 1 micron, which also brings challenges to the preparation technology

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  • Method for preparing osmium membrane through electroplating

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Embodiment Construction

[0018] The osmium film of the present invention and its manufacturing method will be described in detail below with reference to the accompanying drawings.

[0019] The osmium film of the present invention is made by electroplating, its thickness can reach more than 1 micron, and it is not easy to crack. Wherein, the osmium film of the present invention takes a glass substrate as the substrate 1, and a chromium layer 2 is vacuum evaporated on the substrate 1. The thermal expansion coefficient of osmium and quartz is large, so the chromium film with a small thermal expansion coefficient is selected as the bottom layer to increase The bonding strength between the resistive film and the quartz substrate is very necessary. At the same time, due to the low conductivity of chromium, it is difficult to provide the current intensity required for electroplating. Therefore, it is necessary to deposit a layer with high conductivity and good chemical stability on the chromium film. A gold...

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Abstract

The invention discloses an osmium membrane with thickness over 1 micrometer and its preparation method. The method comprises: plating a chromium membrane on a glass substrate through a PVD (physical vapor deposition) method, then plating a layer of gold membrane with high electric conductivity and good chemical stability on the chromium membrane through a PVD method, and finally electroplating an osmium membrane on the gold membrane. In the invention, electroplating is carried out by several times, so that the thickness of the osmium membrane can be more than 1 micrometer. The osmium membrane prepared in the invention can be used for preparing space atomic oxygen environment detectors. And the method provided in the invention solves the problems of easy cracking and inadequate thickness in osmium membranes deposited by the traditional PVD method.

Description

technical field [0001] The invention relates to an electroplating method, in particular to a method for preparing an osmium film by using the electroplating method. Background technique [0002] In spacecraft orbital environment detection technology, osmium film resistance detectors are required. Generally, the traditional manufacturing method of osmium film is plasma vapor deposition (PVD method), but the osmium film deposited by PVD method is prone to cracking, which is difficult to meet the requirements of use, and the osmium film needs to reach a certain thickness, such as The thickness reaches more than 1 micron, which also brings challenges to the preparation technology. Therefore, there is an urgent need for a crack-resistant osmium film and the manufacturing process of the osmium film, so as to complete the detection of the orbital atomic oxygen environment of the spacecraft. Contents of the invention [0003] In order to solve the above-mentioned problems, the p...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/54C25D17/10C23C14/24C23C14/18
Inventor 刘向鹏童靖宇李涛姜海富赵雪贾铮
Owner BEIJING INST OF SPACECRAFT ENVIRONMENT ENG
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