SnZn-based lead-free brazing filler metal containing Cr

Abstract

The invention belongs to the field of welding material, and particularly relates to a SnZn-based lead-free brazing filler metal containing Cr suitable for reflow soldering and wave soldering in electronic packing. The SnZn-based lead-free brazing filler metal comprises 0.01 to 0.1 percent by weight of Ni, 0.001 to 0.01 percent by weight of P, 0.05 to 0.2 percent by weight of Nd, 0.1 to 0.5 percent by weight of In, 0.01 to 0.5 percent by weight of Cr, 1 to 5 percent by weight of Bi, 7 to 11 percent by weight of Zn, and Sn in balancing amount; and the weight percentage sum of all the components is 100%. The SnZn-based lead-free brazing filler metal has excellent antioxygenic property, wettability and mechanical property, the melting point is equal to that of a conventional SnPb brazing filler metal, copper precipitation is not required, the SnZn-based lead-free brazing filler metal is suitable for reflow soldering and wave soldering, traditional brazing packing devices and electronic components.

Description

technical field [0001] The invention belongs to the field of soldering materials, in particular to a Cr-containing SnZn-based lead-free solder suitable for reflow soldering and wave soldering in electronic packaging. Background technique [0002] With the increase of people's awareness of environmental protection, lead-free electronic interconnection materials is a global trend. However, due to the higher melting point of the existing lead-free solder than the traditional Sn-Pb solder, the brazing temperature increases, which will inevitably cause thermal damage to electronic components and circuit boards, and bring compatibility between existing equipment and lead-free solder sexual issues. Especially for heat-sensitive components, since there is no suitable lead-free solder to use, Sn-Pb solder has to be used at this stage, and it cannot be completely lead-free, which will cause harm to the environment and cause harm to the human body. poison. Therefore, it is necessary...

AI Technical Summary

Problems solved by technology

[0006] The object of the invention is to, aim at the deficiencies in the prior art, provide a kind of Sn-Zn base lead-free solder that is applicable to reflow soldering and wave soldering in the electronic packaging, to overcome the resistance of traditional Sn-9Zn lead-free solder Disadvantages such as poor oxidation ability, low wetting ability and low shear strength