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SnZn-based lead-free brazing alloy

A lead-free solder and alloy technology, applied in metal processing equipment, welding/cutting media/materials, welding media, etc., can solve the problems of low wettability, poor oxidation resistance, etc., achieve low cost, improve efficiency, The effect of excellent oxidation resistance and wetting properties

Inactive Publication Date: 2012-06-13
广东中实金属有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to, aim at the deficiencies in the prior art, and provide a kind of Sn-Zn base lead-free solder alloy suitable for reflow soldering and wave soldering in electronic package, this alloy can overcome traditional Sn-9Zn lead-free solder alloy Disadvantages of poor oxidation resistance and low wetting ability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A SnZn-based lead-free solder alloy, the solder alloy is composed of the following chemical components by weight percentage: Ni: 0.01wt%, P: 0.001wt%, Nd: 0.05wt%, In: 0.1wt%, Bi: 1 wt%, Zn: 7 wt%, and Sn: 91.839 wt%.

Embodiment 2

[0025] A SnZn-based lead-free solder alloy, the solder alloy is composed of the following chemical components by weight percentage: Ni: 0.03wt%, P: 0.002wt%, Nd: 0.1wt%, In: 0.2wt%, Bi: 2wt%, Zn: 8wt%, and Sn: 89.668wt%.

Embodiment 3

[0027] A SnZn-based lead-free solder alloy, the solder alloy is composed of the following chemical components by weight percentage: Ni: 0.05wt%, P: 0.004wt%, Nd: 0.15wt%, In: 0.3wt%, Bi: 3 wt%, Zn: 9 wt%, and Sn: 87.496 wt%.

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PUM

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Abstract

The invention belongs to the field of welding materials and in particular relates to a SnZn-based lead-free brazing alloy. The brazing alloy comprises the following chemical components by weight percent: 0.01-0.1wt% of Ni, 0.001-0.01wt% of P, 0.05-0.2wt% of Nd, 0.1-0.5wt% of In, 1-5wt% of Bi, 7-11wt% of Zn and the balance of Sn, wherein the total weight percent of all the components is 100%. Compared with the prior art, the brazing alloy has the following advantages that: the brazing alloy has excellent oxidation resistance, wettability and mechanical property; the melting point of the brazing alloy is equivalent to that of the traditional SnPb brazing alloy; copper precipitation is avoided; and the brazing alloy is suitable for wave welding and reflow welding and traditional brazing packaging devices and electronic components.

Description

technical field [0001] The invention belongs to the field of welding materials, in particular to a SnZn-based lead-free solder alloy. Background technique [0002] With the increase of people's awareness of environmental protection, lead-free electronic interconnection materials is a global trend. However, due to the higher melting point of the existing lead-free solder than the traditional Sn-Pb solder, the brazing temperature increases, which will inevitably cause thermal damage to electronic components and circuit boards, and bring compatibility between existing equipment and lead-free solder sexual issues. Especially for heat-sensitive components, since there is no suitable lead-free solder to use, Sn-Pb solder has to be used at this stage, and it cannot be completely lead-free, which will cause harm to the environment and cause harm to the human body. poison. Therefore, it is necessary to develop low melting point lead-free solder. [0003] In the process of looking...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 陈锋方喜波梁静珊
Owner 广东中实金属有限公司