Method for embedding capacitor into PCB (printed circuit board) multilayer board
A technology of embedded capacitors and multi-layer boards, applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems of broken capacitor materials, pollution of production lines, folding boards, etc., and achieve the effect of reducing production costs, reducing design requirements, and diversifying designs.
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[0020] like Figure 1 to Figure 6 As shown, the method for embedding a capacitor in a PCB multilayer board of the present invention includes the following steps:
[0021] Step 1. Provide several inner-layer core boards 10 and two embedded capacitance core boards 11 . The embedded capacitance core boards 11 include a buried capacitance material layer 111 in the middle and a copper layer 112 respectively located on both sides of the buried capacitance material layer 111 . ;
[0022] Step 2, the first inner layer dry film: making the secondary outer layer pattern for the buried capacity core board 11 and making the inner layer pattern for the inner layer core board 10, including developing, etching, film stripping and other processes;
[0023] Step 3. Provide several pieces of prepreg 13, and stack the inner core board 10, the prepreg 13 and the embedded core board 11 in a predetermined stacking sequence, and the embedded core board 11 is located on two opposite outer sides of t...
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