Method for embedding capacitor into PCB (printed circuit board) multilayer board

Abstract

The invention relates to a method for embedding a capacitor into a multi-layer PCB (printed circuit board). The method comprises the following steps: 1, providing multiple inner core boards and two capacitor-embedded core boards, wherein each capacitor-embedded core board comprises a capacitor-embedded material layer in the middle and two copper layers at two sides; 2, primary inner-layer film drying: making secondary outer patterns on the capacitor-embedded core boards and manufacturing inner patterns on the inner core boards; 3, providing multiple prepregs, and superimposing the inner core boards, the prepregs and the capacitor-embedded core boards according to a preset superimposition sequence; 4, carrying out primary lamination so as to form a daughter board; 5, secondary inner-layer film drying: making outer patterns on the capacitor-embedded core boards of the daughter board; and 6, carrying out secondary lamination so as to form a mother board with a capacitor-embedded layer. In the method for embedding a capacitor into a multi-layer PCB (printed circuit board) disclosed by the invention, the patterns of the capacitor-embedded layer are made by using a single-side etching and two-time lamination process, so that the problems of board clamping and breaking and the like caused if the capacitor-embedded layer is too thin and crisp can be effectively avoided, the cost for making the patterns of the capacitor-embedded layer is reduced, and the qualified rate is improved.

Description

technical field [0001] The invention relates to the field of manufacturing printed circuit boards (Printed Circuit Board, PCB), in particular to a method for embedding capacitors in a PCB multilayer board. Background technique [0002] With the rapid development of electronic industry technology, embedding materials tend to choose high dielectric constant (Dk) ceramic fillers and ultra-thin and medium-thick embedding plates in order to obtain high capacitance density. Such plates use traditional double-sided etching methods to make inner layer graphics. The following difficulties: (1) The graphic production of the embedding material layer is very easy to jam, fold, and even the embedding material in the copper-free area is broken, scattered in the etching cylinder and polluting the production line; (2) The etching process of the embedding material layer The performance requirements of the inner layer etching line equipment are too high, and it is difficult to achieve mass pr...

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of electronic industry technology, embedding materials tend to choose high dielectric constant (Dk) ceramic fillers and ultra-thin and medium-thick embedding plates in order to obtain high capacitance density. Such plates use traditional double-sided etching methods to make inner layer graphics. The following difficulties: (1) The graphic production of the embedding material layer is very easy to jam, fold, and even the embedding material in the copper-free area is broken, scattered in the etching cylinder and polluting the production line; (2) The etching process of the embedding material layer The performance requirements of the inner layer etching line equipment are too high, and it is difficult to achieve mass production; (3) The inner layer film of the embedding material layer must use a special dry film, and the film is easy to roll

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