Epoxy-functionalized perfluoropolyether polyurethanes

Abstract

Disclosed are epoxy-functionalized perfluoropolyether polyurethane compounds having the following general structure (RfQX1C(O)NH)m-Ri-(NHC(O)X2Q(E)o)n wherein Rf is a monovalent perfluoropolyether moiety; Q is independently a connecting group of valence at least 2, which may contain heteroatoms; X1 is O, S, or NR, wherein R is H or a lower alkyl of 1 to 4 carbon atoms; Ri is a residue of a multi-isocyanate; X2 is O, S, or NR, wherein R is a lower alkyl of 1 to 4 carbon atoms; E is an organic group having at least one oxirane ring; m is at least 1; n is at least 1; o is 1, 2 or 3; and m + n is from 2 to 10.

Description

technical field [0001] The present invention relates to epoxy-functionalized perfluoropolyether polyurethane compounds and to hardcoat compositions comprising said compounds. Background technique [0002] In the printed circuit industry, a photomask or stencil with a circuit pattern is called a negative. The stencil through which the photoresist can be exposed provides an intricate image representing the circuit. The image is usually composed of many thin lines with closely spaced connections. During the manufacture of printed circuit boards therefrom, a negative is placed face down on a layer of photoresist and then contact printing is achieved by exposing the photoresist to high intensity light through the negative. In this way, a single negative can be used to achieve multiple contact printing. [0003] After processing, negatives can be carefully inspected through a microscope to ensure that the fine lines of the image are not broken. Continuing use of the film can d...

AI Technical Summary

Problems solved by technology

However, many protective overcoats have limited release properties and thus tend to stick to the surface of the photoresist, especially when relatively viscous materials such as high viscosity solder mask inks are present

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