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High-strength tin cadmium lead-free solder alloy and preparation method thereof

一种无铅焊料合金、高强度的技术，应用在焊接设备、金属加工设备、焊接/切割介质/材料等方向，能够解决熔点高、限制合金使用范围、合金抗拉强度不够高等问题，达到铺展性能优异、成本低、易于焊接的效果

Inactive Publication Date: 2014-01-08
NANJING UNIV OF INFORMATION SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The melting point of the alloy is high, and the tensile strength of the alloy is not high enough
Therefore, the scope of use of the alloy is limited

Method used

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  • High-strength tin cadmium lead-free solder alloy and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0021] The preparation method of the high-strength tin-cadmium series lead-free solder alloy of the present invention:

[0022] Firstly, according to the alloy composition of 20wt% of Cd, 0.01wt% of Bi, 0.01wt% of Sb, 0.01wt% of Sr, 0.01wt% of La, and the balance is Sn. The purity of raw materials Cd, Bi, Sb, Sr, La, and Sn is greater than 99.9%. The raw materials are melted in a vacuum induction furnace at a melting temperature of 460°C to obtain a master alloy, which is then placed in a heavy vacuum induction furnace. Carry out remelting in a melting tube crucible, the remelting temperature is 390°C, the bottom of the remelting tubular crucible is placed 2-4mm above the rim of the runner of the quenching furnace, and the above master alloy is placed in the tubular crucible for melting After the alloy is melted, under the action of argon, it is sprayed from the hole with a diameter of 1mm at the bottom of the crucible and contacts the edge of the rotating runner to form an al...

Embodiment 2

[0024] The preparation method of high-strength tin-cadmium series lead-free solder alloy:

[0025] First according to Cd is 40wt%, Bi is 0.03wt%, Sb is 0.03wt%, Sr is 0.03wt%, La is 0.03wt%, and the balance is the alloy composition of Sn to carry out batching, raw material Cd, Bi, Sb, Sr, The purity of La and Sn are both greater than 99.9%. The raw materials are melted in a vacuum induction furnace at a melting temperature of 460°C to obtain a master alloy, which is then remelted in a remelting tubular crucible in a vacuum induction quenching furnace. The remelting temperature is 390°C, the bottom of the remelting tubular crucible is placed 2-4mm above the rim of the runner of the quenching furnace, and the above master alloy is placed in the tubular crucible to melt, and the alloy is melted under the action of argon Spray from the hole with a diameter of 1mm at the bottom of the crucible and contact the edge of the rotating runner to form an alloy strip with a thickness of 25...

Embodiment 3

[0027] The preparation method of high-strength tin-cadmium series lead-free solder alloy:

[0028] First according to Cd is 30wt%, Bi is 0.02wt%, Sb is 0.02wt%, Sr is 0.02wt%, La is 0.02wt%, the balance is the alloy composition of Sn to carry out batching, raw material Cd, Bi, Sb, Sr, The purity of La and Sn is greater than 99.9%. The raw materials are melted in a vacuum induction furnace at a melting temperature of 470°C to obtain a master alloy, which is then remelted in a remelting tubular crucible in a vacuum induction quenching furnace. The remelting temperature is 400°C, the bottom of the remelting tubular crucible is placed 2-4mm above the rim of the runner of the quenching furnace, and the above master alloy is placed in the tubular crucible to melt, and the alloy is melted under the action of argon Spray from a hole with a diameter of 1mm at the bottom of the crucible and contact the edge of the rotating runner to form an alloy strip with a thickness of 250-350 micron...

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Abstract

The invention provides a high-strength tin cadmium lead-free solder alloy and a preparation method thereof. The alloy material has a low melting point, high spreadability, and high tensile strength, so the alloy has good weldability. The preparation method has a simple process and a low production cost, and is suitable for industrial production. The high-strength tin cadmium lead-free solder alloy is characterized by comprising the following components: 20-40wt% of Cd, 0.01-0.03wt% of Bi, 0.01- 0.03wt% of Sb, 0.01-0.03wt% of Sr, 0.01- 0.03wt% of La, and the balance being Sn.

Description

Technical field: [0001] The invention is a metal material field involving a high -intensity tin cadmium -free welded alloy and its preparation methods and their preparation methods. Background technique: [0002] CN200810226519.6 Invention involves a low -cost lead -free welded, which specializes in a low -cost tin -zinc, copper -free welded welded welded and its formed welds (or welded seams), which belongs to the technical and application fields of 钎 welding materials.The percentage of the components and its mass of the invention of the invention is: Zn: 6.0-10.0 %, BI: 1.0-3.0 %, CU: 0.5-1.0 %, and the balance is SN.Compared with SN-PB welded and traditional SN-Zn solder, the invention provides a contaminated and easy-to-welded lead-free solder alloy.The advantage of this weld is 185-200 ° C, and the tensile strength is 92-94MPa.The spread area of 51-59 (CU: mm2 / 0.2g).The melting point of the alloy is high, and the tensile strength of the alloy is not high enough.As a result,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/02C22C13/00B22D11/06
Inventor 王玲赵浩峰陈文兵范乐王倩项青霞许根俊
Owner NANJING UNIV OF INFORMATION SCI & TECH
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