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Plate cleaning device and plate cleaning method

A cleaning device and plate technology, applied in the cleaning/polishing of conductive patterns, secondary treatment of printed circuits, etc., can solve the problems of difficult removal of attachments and complex components, and achieve equipment integration with compact structure, improved economic benefits, and reduced The effect of production costs

Inactive Publication Date: 2014-05-28
HUNAN VARY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a board cleaning device to solve the technical problem that the complicated attachments attached to the board are difficult to remove

Method used

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  • Plate cleaning device and plate cleaning method
  • Plate cleaning device and plate cleaning method

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Embodiment Construction

[0028] The embodiments of the present invention are described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways as defined and covered by the claims.

[0029] see figure 1 and figure 2 , The plate cleaning device of the embodiment of the present invention is mainly used to remove the crystalline substances attached to the surface of the plate, and is especially suitable for the cleaning of copper plates that use electrolytic methods to extract metallic copper in an alkaline etching solution. Liquid crystals, such as copper chloride and ammonium chloride crystals. The plate cleaning device includes: a cleaning bucket 1 , a pickling cycle system 2 , a cleaning cycle system 3 , a water washing cycle system 4 , an automatic controller 5 , an outer tub 6 and a cover plate 7 .

[0030] The washing tub 1 is arranged in the outer tub 6 . The pickling circulation system 2, the cleaning circulation system...

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Abstract

The invention provides a plate cleaning device, which comprises a cleaning bucket (1), a scouring circulation system (2), a cleaning circulation system (3) and a rinsing circulation system (4). Plates can be scoured, cleaned and rinsed by water and the like in the plate cleaning device. The invention further provides a plate cleaning method, which is utilized by the plate cleaning device. The plate cleaning device utilizes the mode of scouring, cleaning and rinsing, can effectively remove substances attached on the plates, and particularly can remove alkali substances attached on electrolysis copper plates recovered from alkali etching liquor. Multiple procedures are integrated in one groove, so that the plate cleaning device is quite compact in integrated structure, space of the plate cleaning device is greatly reduced and production cost is reduced simultaneously.

Description

technical field [0001] The invention relates to the field of plate cleaning, in particular, to a plate cleaning device. In addition, the present invention also relates to a plate cleaning method using the above plate cleaning device. Background technique [0002] In the field of PCB cleaner production, alkaline etching solution regeneration and copper recovery systems have a large market share, and electrolysis is the most advanced copper recovery technology. . However, in the production process, after the copper is electrolyzed, the copper plate is lifted from the etching solution, and a layer of etching solution will be attached to the outer surface. The main components attached are copper chloride and ammonia chloride. After being placed in the air, the surface layer will be It crystallizes quickly and sticks to the copper plate, and the surface looks blue, which leads to the insufficient purity of the copper plate and the appearance is not very good. At present, there...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/26
Inventor 明果英周军张勇李高峰刘红江张红胜
Owner HUNAN VARY TECH
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