Polyimide metal overprinting body and preparation method thereof, and dual-sided metal overprinting body

A polyimide and polyimide layer technology is applied in the fields of polyimide metal laminates and preparation methods and double-sided metal laminates, which can solve the problems of thermal expansion coefficient molecular structure limitation and the like, and achieve good dimensional stability. , the effect of high peel strength

Active Publication Date: 2012-07-04
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But, according to the double-sided metal laminate of CN100446971C, the coefficient of thermal expansion and the molecular struc

Method used

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  • Polyimide metal overprinting body and preparation method thereof, and dual-sided metal overprinting body
  • Polyimide metal overprinting body and preparation method thereof, and dual-sided metal overprinting body

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0088] 400mL of N,N-dimethylacetamide was placed in a glass reactor, and 22.22g of 4,4'-diaminodiphenyl ether (4,4'-ODA) was added under continuous stirring. purchased from Shandong Wanda Chemical Co., Ltd.) and stirred until completely dissolved. Then, 35.77g of 3,3',4,4'-benzophenonetetraacid dianhydride (3,3',4,4'-BTDA) (commercially purchased from Beijing Marti Technology Co., Ltd. company). The resulting mixture was stirred at 25° C. for 6 hours to obtain a polyamic acid solution (PA-1) having a solid content of 14.5% by weight and a viscosity of 53900 cP.

Synthetic example 2

[0090] 400mL of N,N-dimethylacetamide was placed in a glass reactor, and 29.90g of 1,3-bis(4-aminophenoxy)benzene (TPER) (commercially available from Qingdao Hanbing Chemical Co., Ltd.), and stir until completely dissolved. Add 30.10g of 3,3',4,4'-biphenyltetracarboxylic dianhydride (3,3',4,4'-BPDA) (commercially purchased from Shanghai Yousheng Chemical Technology Co., Ltd. ). The resulting mixture was stirred at 25° C. for 4 hours to prepare a polyamic acid solution (PA-2) having a solid content of 15% by weight and a viscosity of 9600 cP.

Synthetic example 3

[0092] 400mL of N,N-dimethylformamide was placed in a glass reactor, and 48.08g of 4,4'-diaminodiphenyl ether (4,4'-ODA) was added under continuous stirring, and Stir until completely dissolved. Then, 51.92 g of pyromellitic dianhydride (PMDA, commercially available from Fanxian Senyuan Chemical Industry Co., Ltd.) was added into the above reactor. The obtained mixture was stirred at 25° C. for 7 hours to obtain a polyamic acid solution (PA-3) having a solid content of 25% by weight and a viscosity of 25300 cP.

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Abstract

The invention provides a polyimide metal overprinting body and a preparation method thereof, and a dual-sided metal overprinting body. The polyimide metal overprinting body comprises a thermosetting polyimide layer, a thermoplastic polyimide layer and a metal substrate layer, wherein the thermosetting polyimide layer is arranged between the thermoplastic polyimide layer and the metal substrate layer, a melt viscosity m of thermoplastic polyimide in the thermoplastic polyimide layer is above 0.1Pa.s and is lower than 10Pa.s, the thickness n3 of the thermoplastic polyimide layer and the melt viscosity of the thermoplastic polyimide meet the following relation: when m is not less than 0.1Pa.s and is not more than 1Pa.s, n3/m is 1-70, and when the is not less than 1Pa.s and is not more than 10Pa.s, n3/m is 0.5-13. The polyimide metal overprinting body has good size stability, and the thermoplastic polyimide layer has high peeling strength; meanwhile, the thickness of the polyimide metal overprinting body is regulated and controlled according to the melt viscosity of the thermoplastic polyimide, so that use requirements of different application occasions are met.

Description

technical field [0001] The invention relates to a polyimide metal laminate, a preparation method and a double-sided metal laminate. Background technique [0002] With the development of electronic products in the direction of light weight and miniaturization, the demand for flexible printed circuit boards (FPC) is increasing. [0003] Generally speaking, the preparation method of the flexible printed circuit board includes: attaching an adhesive layer on the surface of the insulating film by thermocompression bonding, and bonding the adhesive layer to the metal foil. The flexible printed circuit board prepared by the above method is generally called a three-layer type glued FPC. The insulating film is preferably a film made of polyimide, and the adhesive is usually an epoxy resin adhesive and / or an acrylic resin adhesive. The adhesive has the advantage of being able to bond at lower temperatures. However, many properties of the three-layer adhesive FPC are limited by the ...

Claims

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Application Information

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IPC IPC(8): B32B15/08B32B15/20
Inventor 赵婷婷吴波
Owner BYD CO LTD
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