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Black coarsening treatment process for surface of very-low-profile copper foil

A roughening and low profile technology, applied in the field of black roughening process, can solve the problems of low surface profile, achieve excellent resistance to normal temperature, good corrosion resistance and etching, and solve the effect of skin effect

Inactive Publication Date: 2012-07-04
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to its ultra-low surface profile, it can effectively solve the "skin effect" problem of electromagnetic signals during transmission, so it is also suitable for high-frequency circuit boards

Method used

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  • Black coarsening treatment process for surface of very-low-profile copper foil
  • Black coarsening treatment process for surface of very-low-profile copper foil
  • Black coarsening treatment process for surface of very-low-profile copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A black roughening treatment process on the surface of ultra-low profile copper foil, the specific treatment conditions are as follows:

[0028] (1) Coarse Cu 2+ 16g / L, Ni 2+ 12g / L,H 2 SO 4 100g / L, temperature 25℃, current density 35A / dm 2 , the processing time is 7s.

[0029] (2) Blackening: Cu 2+ 6g / L, Co 2+ 0.8g / L, Fe 2+ 1.0g / L,H 2 SO 4 150g / L, additive 1.0g / L, temperature 20°C, current density 6A / dm 2 , the processing time is 10s.

[0030] (3) Anti-oxidation: Cr 6+ 5.8g / L, Zn 2+ 2.5g / L,K 4 P 2 o 7 150 g / L, pH 11, temperature 40 ℃, current density 5.8 A / dm 2 ; Processing time 2.6s.

[0031] (4) Silane coupling agent: 2g / L, temperature 30°C, treatment time 2s.

[0032] (5) Drying: temperature 200°C, processing time 4s.

Embodiment 2

[0034] (1) Coarse Cu 2+ 25g / L, Ni 2+ 10g / L,H 2 SO 4 80g / L, temperature 20℃, current density 50A / dm 2 , the processing time is 5s.

[0035] (2) Blackening: Cu 2+ 10g / L, Co 2+ 0.2g / L, Fe 2+ 0.5g / L,H 2 SO 4 80g / L, additive 25g / L, temperature 35°C, current density 8.5A / dm 2 , the processing time is 8s.

[0036] (3) Anti-oxidation: Cr 6+ 15g / L, Zn 2+ 5 g / L, K 4 P 2 o 7 220 g / L, pH 9.5, temperature 45 ℃, current density 10 A / dm 2 ; Processing time 0.5s.

[0037] (4) Silane coupling agent: 10g / L, temperature 30℃, treatment time 3s.

[0038] (5) Drying: temperature 300°C, processing time 3s.

Embodiment 3

[0040] (1) Coarse Cu 2+ 20g / L, Ni 2+ 16g / L,H 2 SO 4 220g / L, temperature 35℃, current density 20A / dm 2 , the processing time is 15s.

[0041] (2) Blackening: Cu 2+ 5g / L, Co 2+ 2.5g / L, Fe 2+ 0.3g / L,H 2 SO 4 100g / L, additive 0.3g / L, temperature 45℃, current density 4.5A / dm 2 , the processing time is 15s.

[0042] (3) Anti-oxidation: Cr 6+ 1.5g / L, Zn 2+ 0.2g / L, K 4 P 2 o 7 80 g / L, PH 12, temperature 50 ℃, current density 10A / dm 2 ; Processing time 5s.

[0043] (4) Silane coupling agent: 0.5g / L, temperature 25°C, treatment time 3s.

[0044] (5) Drying: temperature 100°C, processing time 8s.

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Abstract

The invention relates to a black coarsening treatment process for the surface of a very-low-profile copper foil, belonging to the technical field of high-precision electrolytic copper foil production technology. After the surface of the very-low-profile copper foil is subjected to the treatments of coarsening, blackening, antioxidation, silane coupling agent spraying, and drying, the roughness of the surface is less than 2.5 microns, is of a black color, has good corrosion and etching resistance and excellent oxidation resistance to normal temperature and high temperature, so that the very-low-profile copper foil is particularly applicable to flexible copper clad laminates and high-frequency circuit boards.

Description

[0001] technical field [0002] The invention relates to a black roughening process for the surface of ultra-low profile copper foil, and belongs to the technical field of high-precision electrolytic copper foil production process. Background technique [0003] Flexible printed circuit board (FPC), referred to as soft board, has the advantages of softness, lightness, thinness and flexibility. It has been widely used in notebook computers, digital Cameras, mobile phones, video cameras, LCD monitors and other products. my country is a big exporter of printed circuit boards. As the integration of printed circuit boards increases, electronic circuits tend to be high-precision and high-density, and the frequency of signal transmission is getting higher and higher. This requires that the copper foil used must have excellent etching properties. , oxidation resistance, elongation, ultra-low surface profile and other properties. At present, there is a large gap in the production t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/12C25D3/58C25D3/56C25D5/48C25D7/06
Inventor 杨祥魁徐树民刘建广马学武宋召霞徐策王涛
Owner SHANDONG JINBAO ELECTRONICS
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