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CMOS (complementary metal-oxide-semiconductor)-machine-vision-based component size measuring system and measurement test method

A measurement system and machine vision technology, applied in measurement devices, instruments, optical devices, etc., to achieve the effects of good economy, good linearity, and high repeatability

Inactive Publication Date: 2015-05-20
ZHONGBEI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, it is difficult to accurately measure the diameter of the micro-via hole and the width of the bottom of the trumpet-shaped groove with the existing dimensional measurement methods.

Method used

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  • CMOS (complementary metal-oxide-semiconductor)-machine-vision-based component size measuring system and measurement test method
  • CMOS (complementary metal-oxide-semiconductor)-machine-vision-based component size measuring system and measurement test method
  • CMOS (complementary metal-oxide-semiconductor)-machine-vision-based component size measuring system and measurement test method

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Experimental program
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Effect test

Embodiment 1

[0028] A dimension measurement system based on CMOS machine vision includes an image acquisition module, an image processing module and a dimension measurement module. figure 1 The overall frame diagram of the automatic part size measurement system based on CMOS machine vision is given. The image acquisition module completes the image acquisition function of the contour edge of the captured part; the image processing module binarizes and filters the collected image, and then passes edge detection to obtain the edge of the part image; the size measurement module extracts and calculates the The pixel value of the edge contour of the measured object can be obtained, and through calibration, the pixel value can directly reflect the size of the part.

[0029] The structure of the image acquisition module is as follows: figure 2 , including an imaging system and a mechanical part, the mechanical part includes a base plate 1, a positioning block 2, a vertical plate 3, a backlight 4...

Embodiment 2

[0042] The inspection method for whether the part size is qualified or not. A part size measurement system based on CMOS machine vision is composed of a base plate, a positioning block, a vertical plate, a backlight, an imaging system, a horizontal adjustment plate, a vertical adjustment plate, etc. The imaging system is composed of a camera assembly and a camera installation block. The camera assembly includes eyepiece, objective lens, lens barrel and CMOS camera, the positioning block is fixedly installed on the base plate, the vertical plate is fixed on the positioning block by screws, the backlight is fixed on the vertical plate, and the horizontal The adjustment plate is fixedly installed on the base plate, the vertical adjustment plate is installed on the horizontal adjustment plate, and there is a track on the horizontal adjustment plate, and the vertical adjustment plate is installed on the horizontal adjustment plate. The vertical adjustment plate can move on the hori...

Embodiment 3

[0045] A method for measuring the diameter of micro-vias. A part size measurement system based on CMOS machine vision is composed of a base plate, a positioning block, a vertical plate, a backlight, an imaging system, a horizontal adjustment plate, a vertical adjustment plate, etc. The imaging system is composed of a camera assembly and a camera installation block. The plug-in CMOS camera is fixed at the rear end of the camera assembly. The camera assembly is installed on the camera mounting block, which is roughly the same height as the backlight source. The workpiece to be measured is located between the imaging system and the backlight source. The middle area of ​​the image can thus adapt to the size measurement requirements of different parts; the clarity of imaging can be achieved by adjusting the installation position of the mounting block and the camera mounting block, thereby changing the distance between the measured workpiece and the imaging system. Compared with th...

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Abstract

The invention discloses a CMOS (complementary metal-oxide-semiconductor)-machine-vision-based component size measuring system and a measurement test method. The CMOS-machine-vision-based component size measuring system comprises an image acquisition module, an image processing module and a size measuring module, wherein the image acquisition module acquires images of contour edges of a shot component; the image processing module performs binaryzation and filtering processing on the acquired images, and then performs edge detection to obtain edges of the images of the component; and the size measuring module calculates a pixel value of an edge contour of a measured object through feature extraction, and the pixel value can directly reflect the size of the component through calibration. According to the CMOS-machine-vision-based component size measuring system and the measurement test method disclosed by the invention, the measurement of the contour size can be realized, and the measurement of the aperture of a small through hole can be finished; and after a special assistant tool is provided, the measurement of the bottom width of a trumpet-shaped groove can be realized.

Description

technical field [0001] The invention belongs to the field of machine vision, and relates to a part size measurement system and a measurement inspection method based on CMOS machine vision. Specifically, it realizes the measurement of the outer dimensions of parts of the same specification through a visual device built with a CMOS camera and an optical lens as the core. Non-contact accurate measurement and judgment of whether the parts are qualified or not, the system can also realize the measurement of the diameter of the micro-through hole and the width of the bottom of the horn-shaped groove. Background technique [0002] In modern industrial production, it involves a variety of inspection, production monitoring and parts identification applications, such as dimensional inspection of batch processing of spare parts, integrity inspection of automatic assembly, automatic positioning of components in electronic assembly lines, and character recognition of ICs etc. Usually, th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/00G01B11/24
Inventor 王俊元段能全曾志强马维金张纪平杜文华高俊华王洪福张启升高琼
Owner ZHONGBEI UNIV
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