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Scintillator-photosensor sandwich, production method therefor and radiation detector

A technology for photoelectric sensors and ray detectors, which can be used in semiconductor devices, electrical components, radiation intensity measurement, etc., and can solve the problem of high cost

Inactive Publication Date: 2012-07-04
SIEMENS AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The problem in this case is that the procedure disclosed above, in particular due to the part to be carried out under vacuum, makes the cost prohibitive

Method used

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  • Scintillator-photosensor sandwich, production method therefor and radiation detector
  • Scintillator-photosensor sandwich, production method therefor and radiation detector
  • Scintillator-photosensor sandwich, production method therefor and radiation detector

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Embodiment Construction

[0031] exist Figure 1 to Figure 6 The method for producing a scintillator-photosensor-multilayer component according to the invention is shown schematically in different variants.

[0032] figure 1 The gluing of a transfer adhesive tape 1 is shown, which consists of an adhesive layer 1.2 and two protective films 1.1 and 1.3 arranged on both sides, wherein, before the adhesive layer 1.2 of the transfer adhesive tape 1 is applied, Peel off directly the first protective film 1.1, here the lower protective film, and place the remaining transfer adhesive tape 1 consisting of the adhesive layer 1.2 and the protective film 1.3 arranged above it on the first functional layer 2, e.g. the photosensor layer , and integrally introduced into the pressing gap between the roller 4 and the corresponding roller 5 .

[0033] as from figure 2 It can be seen that at the end of this gluing process at this time behind the two rotating rollers 4 and 5 there is a complete glued part consisting o...

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Abstract

In a method to produce a scintillator-photosensor sandwich (7) for use in a pixel-resolving radiation detector for ionizing radiation, either a scintillator layer or a photosensor layer can respectively be the first and second function layers (2, 3)(alternatively). The method comprises the following steps of: using a transfer adhesive tape (1) comprising at least one protective film (1.1, 1.3) and at least one adhesive layer (1.2) located on or between the protective films; applying the protective film-free side of said adhesive layer of the transfer adhesive tape onto the first function layer (2); implementing a first lamination of the adhesive layer and the second protective film (1.3) located outsides to the first function layer, using at least one roller (4, 5); removing the protective film (1.3) from said adhesive layer; thereafter placing a second function layer (3) on the adhesive layer on said first function layer; and implementing a second lamination of said two function layers with said adhesive layer therebetween, using at least one roller.

Description

technical field [0001] The invention relates to a method for manufacturing a scintillator-photosensor-multilayer (Sandwich), a scintillator-photosensor-multilayer and a ray with said scintillator-photosensor-multilayer A detector, wherein the scintillator-photosensor-multilayer component is made by bonding the scintillator layer on the photosensor layer. Background technique [0002] Scintillators, such as CsI:Tl, are used in medical applications or in NDT (NDT=Non Destructive Testing=nicht- Testen, non-destructive testing) of ionizing radiation, through photoelectric sensors, such as CMOS-array (CMOS=Complementary Metal Oxide Semiconductor, Complementary Metal Oxide Semiconductor) or CCD-array (CCD=Charge Coupled Device, Charge Coupled Device=lichtempfindliches elektronisches Bauelement, photosensitive electronic components), especially in amorphous silicon technology (a-Si) on aluminum substrates or GOS gadolinium oxide amplifier films (GOS=Gadoliniumoxysulfid=Gd202S). ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01T1/20H01L31/115H01L31/18
CPCH01L31/02322
Inventor M.福克斯B.豪希尔德K.洛瓦克U.毛利沙特A.普雷斯勒
Owner SIEMENS AG
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