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Conductive connection material, method for connection between terminals and method for manufacturing connecting terminal

A technology of conductive connection material and resin composition, which is applied in conductive connection, electrical component connection, printed circuit manufacturing, etc., can solve the problems of insufficient contact, high cost of solder ball production, difficulty in agglomeration of conductive particles, etc., and achieve high insulation. Reliability, simple method, effect of good electrical connection

Inactive Publication Date: 2012-07-04
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, it is very difficult to control the aggregation of conductive particles, and sometimes there are the following problems: (1) The conductive particles and the terminals, or the conductive particles are not in sufficient contact with each other, and a part of the opposed terminals is not electrically connected; (2) Conductive particles remain in the resin (insulating region) other than between opposing terminals (conductive region) to generate leakage current, and sufficient insulation between adjacent terminals cannot be ensured.
However, in the above-mentioned method, if the connection terminal is too small, the production cost of the solder ball will be high, and sometimes it is technically difficult to produce a small-diameter solder ball

Method used

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  • Conductive connection material, method for connection between terminals and method for manufacturing connecting terminal
  • Conductive connection material, method for connection between terminals and method for manufacturing connecting terminal
  • Conductive connection material, method for connection between terminals and method for manufacturing connecting terminal

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no. 1 approach

[0198] The method for connecting terminals according to the first embodiment of the present invention includes: an arranging step of arranging the conductive connecting material containing the aforementioned curable resin composition and metal foil between terminals; and heating the conductive connection material at a temperature at which the curing of the curable resin composition does not end; and a curing step of curing the curable resin composition.

[0199] In this connection method, heat-melted solder or tin is selectively aggregated between terminals to form a conductive region, and a curable resin composition is used to form an insulating region around it. As a result, insulation between adjacent terminals can be ensured to prevent leakage current, and therefore connection reliability between terminals can be improved. In addition, electrical connection between a plurality of terminals can be performed at one time also in a fine wiring circuit. Furthermore, by curing ...

no. 2 approach

[0213] Next, a connection method between terminals according to a second embodiment of the present invention will be described. The method for connecting terminals according to the second embodiment of the present invention includes: an arranging step of arranging a conductive connecting material containing the aforementioned thermoplastic resin composition and metal foil between opposing terminals; a heating step of arranging the aforementioned metal foil heating the conductive connecting material at a temperature above the melting point of the above-mentioned thermoplastic resin composition; and curing the thermoplastic resin composition. Next, each step will be described.

[0214] (a) Configuration process

[0215] In the case of using a conductive connecting material containing a thermoplastic resin composition and a metal foil, the conductive connecting material can also be disposed in the same manner as in the case of using a conductive connecting material containing a ...

Embodiment 1～9

[0260] (1) Preparation of curable resin composition

[0261] Each component shown in Table 1 was dissolved in methyl ethyl ketone (MEK) to obtain a varnish of a resin composition having a resin solid content of 40%. The obtained varnish was coated on a polyester sheet using a comma coater, and dried at 90° C. for 5 minutes to obtain a film-like curable resin composition having a thickness of 30 μm.

[0262] (2) Manufacture of conductive connecting materials

[0263] Under the conditions of 60° C., 0.3 MPa, and 0.3 m / min, the obtained film-like curable resin composition was laminated on both surfaces of the solder foil shown in Table 1 to manufacture a 70 μm-thick conductive connecting material.

[0264] (3) Connection between terminals

[0265] Next, terminal-to-terminal connection of the substrate was performed using the obtained conductive connecting material. As the substrate, an FR-4 base material (thickness: 0.1 mm) and a circuit layer (copper circuit, thickness: 12 μm...

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Abstract

Disclosed is a conductive connection material which has a laminated structure comprising a resin composition and metal foil selected from solder foil or tin foil. The resin composition of the conductive connection material has a minimum ion viscosity value of 4 to 9, measured by applying a frequency of 10,000 Hz at the melting point of the metal foil, in compliance with ASTM standard E2039. Further disclosed are a method for connection between terminals using the conductive connection material and a method for manufacturing a connecting terminal. Excellent electrical connection between connecting terminals and high insulation reliability between adjacent terminals can be obtained by employing the conductive connection material.

Description

technical field [0001] The present invention relates to a connection method between a conductive connecting material used for electrically connecting electronic components in electric and electronic parts, a terminal using the conductive connecting material, and a method for manufacturing a connecting terminal. Background technique [0002] In recent years, along with the demand for higher functionality and miniaturization of electronic devices, the narrowing of the pitch between connection terminals in electronic materials has gradually progressed. Along with this, the connection between terminals in the fine wiring circuit also tends to be high-level. As a connection method between terminals, for example, when electrically connecting an IC chip to a circuit board, it is known to use an anisotropic conductive adhesive or an anisotropic conductive film to connect multiple terminals at once. connection technology. Anisotropic conductive adhesive or anisotropic conductive fi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J201/00C09J7/02C09J9/02C09J11/04C09J11/06C09J133/02C09J163/00C09J171/10C09J179/08H01B5/16H01L21/60H01R11/01H01R43/00H05K1/14H05K3/32H05K3/36C09J7/28
CPCH01L2924/01049H05K2203/0405H01L24/29C09J2203/326H01R13/03H01L2924/01045H01L2224/83101H01L2224/293H01L2924/01032H01L2924/01087C08L71/00C08L79/08H01L2924/01004H01L2924/0132H01L2924/01059H01L2924/01078H05K2201/10977H01L2224/29109C08G2650/56H01L2924/14H01L2224/29083H01L24/13H01L2924/01005H01L2224/2919H01L2924/01013H01L2224/131H01L2224/29101H01L2224/29111H05K3/3478C09J7/0242H01L2924/01012H01L2924/0665H01L2924/01051C09J7/0292H01L2924/0781H01L24/83H05K3/305H01L2224/32225H01L2224/111H01L2924/0105C09J2463/00C08L63/00H01L2224/83856H01L2924/01047H01L2224/16225C08L33/08H01L2924/01006H01L2924/0001H01L2924/3025H01L2924/01079H01L2224/2908H01L24/11H05K3/363C09J2400/163H01L2924/0103H01L2224/73204H01L2924/01082H01L2224/13099H01L2924/014H01L2924/01023H01L2924/07811H01L2924/01029H01L2224/13022H01L2924/0133H01L2924/01019H01L24/32H01L2924/01077H01L2924/01033H01L2924/01075H01L2224/29386H01L2224/83886H01L2224/29012H01L2224/29076H01L2224/2929H01L2924/12042C09J7/35C09J7/22C09J7/28H01L2224/83222Y10T428/31678Y10T428/31529C08L2666/02H01L2924/00H01L2924/01083H01L2924/3512H01L2224/29113H01L2924/00012H01L2924/00014H01L2924/00015H01R11/01
Inventor 中马敏秋冈田亘键本奉广
Owner SUMITOMO BAKELITE CO LTD
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