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Light-emitting device based on ceramic substrate and manufacturing method thereof

A technology for light-emitting devices and ceramic substrates, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of high current density, large line width or spacing of metal layers, and decreased luminous efficiency, and achieve the effect of reducing processing technology requirements.

Active Publication Date: 2015-12-16
APT ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method of connecting discrete electrodes on the LED chip to the metal electrode layer on the bottom of the LED chip requires high wiring processing precision, and the line width or spacing of the metal layer is relatively large, so it is difficult to effectively increase the contact area with the N-ohm contact layer. , resulting in a large current difference between the connection points of each N ohm contact layer, and the local current density is too high, resulting in a decrease in luminous efficiency

Method used

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  • Light-emitting device based on ceramic substrate and manufacturing method thereof
  • Light-emitting device based on ceramic substrate and manufacturing method thereof
  • Light-emitting device based on ceramic substrate and manufacturing method thereof

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Embodiment Construction

[0042] Such as image 3 with Figure 3aAs shown, a novel light-emitting device includes at least one LED chip 100 and a ceramic substrate 200 carrying the LED chip 100. The lower surface of the LED chip 100 is provided with a chip first electrode 107 and is electrically connected to the chip first electrode 107. The isolated chip second electrodes 108 and the chip first electrodes 107 are discretely distributed between the chip second electrodes 108 in the form of dots. The upper surface of the ceramic substrate 200 is provided with the substrate first electrode 210 and the substrate second electrode 220 corresponding to the chip first electrode 107 and the chip second electrode 108 to be electrically connected, so that the LED chip 100 is fixed on the ceramic substrate Above 200.

[0043] see Figure 4 with Figure 4a , Figure 4 is a structural schematic diagram of the bottom surface of the LED chip 100, Figure 4a for Figure 4 Sectional view at B-B in the middle. T...

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Abstract

The invention discloses a light emitting device based on a ceramic substrate and a manufacturing method for the light emitting device. The light emitting device comprises at least one light emitting diode (LED) chip and the ceramic substrate for bearing the LED chips, wherein at least one first chip electrode and at least one second chip electrode are arranged on the lower surface of each LED chip; the first chip electrode is dispersively distributed between two second chip electrodes in a dot matrix mode; a first substrate electrode and a second substrate electrode are arranged on the upper surface of the ceramic substrate; the first substrate electrode comprises a first base and at least one first fork finger; the upper surface of the first substrate electrode is electrically connected with the first chip electrode; the second substrate electrode comprises a second base and at least one second fork finger; and the upper surface of the second substrate electrode is electrically connected with the second chip electrodes. According to the light emitting device, a process requirement on the LED chips is reduced, so that dispersed electrodes on the LED chips can be distributed more densely; and therefore, the uniformity of current distribution and the light emitting efficiency are improved.

Description

technical field [0001] The invention relates to a solid light-emitting device and a manufacturing method thereof, in particular to a ceramic substrate-based light-emitting device with high luminous efficiency and a manufacturing method thereof. Background technique [0002] As the luminous efficiency of light-emitting diodes (LEDs) continues to increase, LEDs have undoubtedly become one of the most valued light sources in recent years. LED is a kind of lighting source with energy saving and environmental protection characteristics, which combines high light efficiency, low energy consumption, low maintenance cost and other excellent performances. Theoretically, it is estimated that the luminous efficiency of semiconductor LED lighting fixtures can reach or even exceed 10 times that of incandescent lamps and 2 times that of fluorescent lamps. At present, the goal of LED technology development is high-efficiency, all-solid-state, and environmentally friendly LEDs, and promote...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/38H01L33/48H01L33/62
Inventor 周玉刚姜志荣赖燃兴黄智聪陈海英曾照明肖国伟
Owner APT ELECTRONICS
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