Light-emitting device based on ceramic substrate and manufacturing method thereof
A technology for light-emitting devices and ceramic substrates, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of high current density, large line width or spacing of metal layers, and decreased luminous efficiency, and achieve the effect of reducing processing technology requirements.
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[0042] Such as image 3 with Figure 3aAs shown, a novel light-emitting device includes at least one LED chip 100 and a ceramic substrate 200 carrying the LED chip 100. The lower surface of the LED chip 100 is provided with a chip first electrode 107 and is electrically connected to the chip first electrode 107. The isolated chip second electrodes 108 and the chip first electrodes 107 are discretely distributed between the chip second electrodes 108 in the form of dots. The upper surface of the ceramic substrate 200 is provided with the substrate first electrode 210 and the substrate second electrode 220 corresponding to the chip first electrode 107 and the chip second electrode 108 to be electrically connected, so that the LED chip 100 is fixed on the ceramic substrate Above 200.
[0043] see Figure 4 with Figure 4a , Figure 4 is a structural schematic diagram of the bottom surface of the LED chip 100, Figure 4a for Figure 4 Sectional view at B-B in the middle. T...
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