Starting Layer Core Method

A core board and starting technology, which is applied in the field of carrier boards for making circuit board starting layer core boards, can solve the problems of high cost and low yield of starting layer core boards, etc., and achieve improved yield, reduced thickness, and reduced The effect of manufacturing costs
CN102573335BActive Publication Date: 2016-08-10NEW FOUNDER HLDG DEV LLC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NEW FOUNDER HLDG DEV LLC
Publication Date
2016-08-10

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Abstract

The present invention provides a method for manufacturing an initial layer core board, which includes: preparing at least one seed layer, at least one circuit layer, copper pillar layer and prepreg lamination on a carrier plate to obtain an initial layer core board; The starting layer core plate is separated from the carrier plate; the carrier plate is made of stainless steel or aluminum alloy or titanium alloy. The manufacturing method of the starting layer core board provided by the present invention, by selecting the carrier board made of stainless steel with surface polishing, avoids the high roughness of the carrier board made of copper and affects the quality of the circuit layer, which is conducive to reducing the thickness of the seed layer , reduce the manufacturing cost of the starting layer core board, and then use ultrasonic separation technology to separate the carrier board and the starting layer core board, avoiding the side erosion of the circuit layer when the carrier board and the starting layer core board are separated by etching, thus Improve the yield of starting layer core board.
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Description

technical field

[0001] The present invention relates to the technical field of manufacturing printed circuit boards, in particular to a method for starting core boards and a carrier board for making the starting layer core boards of circuit boards. Background technique

[0002] The rapid development of electronic technology has led to higher and higher integration of semiconductor devices, making packaging substrates gradually develop from single-layer boards to multi-layer boards, such as high-density PCB (printed circuit board) packaging substrates. In order to improve the integration of the PCB packaging substrate, the interlayer connection technology is used to connect the multilayer boards to obtain more available wiring areas in a limited space.

[0003] At present, methods for manufacturing PCB packaging substrates include a core-based build-up method and a non-nuclear build-up method. However, the nucleated packaging substrate manufactured by the nucleated layering ...

Claims

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