High-CTI (comparative tracking index) halogen-free flame retardant resin composition for copper-clad laminate

Abstract

The invention discloses a high-CTI (comparative tracking index) halogen-free flame retardant resin composition for a copper-clad laminate. The composition comprises the following components in parts by weight: 30-70 parts of polyepoxy resin, 1-5 part of curing agent, 0.01-1 parts of curing promoter, and 20-60 parts of filler. The resin composition disclosed by the invention remains high heat resistance while being endued with a high CTI value. The resin composition disclosed by the invention not only contains phosphorus epoxy resin, but also is added with some tough epoxy resins, so that the processing characteristics are greatly improved. The copper-clad laminate fabricated with the resin composition disclosed by the invention has the characteristics of high heat resistance, high CTI value, no halogen, good processing characteristics and the like.

Description

technical field [0001] The invention relates to a high CTI value halogen-free flame-retardant resin composition for copper clad substrates. Background technique [0002] With the rapid development of science and technology, the formation of large-scale industrial integration has caused irreparable damage to the living environment of human beings, so environmental protection has become very urgent. In recent years, with the rapid development of electronic technology, the impact of electronic products on the environment has become increasingly serious, especially electronic waste products. At present, most electronic products are halogen flame-retardant. Very corrosive hydrogen halide gases are produced. According to literature reports, in recent years, halogen-containing flame retardants will produce carcinogens such as dioxins and dibenzofurans when they are cracked and burned at high temperatures. The Directive on the Restriction of the Use of Hazardous Substances in Elec...

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Problems solved by technology

[0004] In recent years, some high CTI boards are mainly CEM-3 materials, but since the implementation of lead-free in the electrical and electronic related industries, the high temperature environment requirements for product applications have also been increasing accordingly, and new requirements have been placed on the heat resistance of materials. Therefore, CEM-3 materials are unable to meet the above requirements, and some existing FR4 plates with high CTI also have the problem of poor heat resistance. This kind of plates generally use ATH (aluminum hydroxide) to provide CTI, but Adding more ATH will cause a decrease in heat resistance, and adding less ATH will not meet the requirements for flame retardancy

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