High-power white light emitting diode (LED) module encapsulated by nano silver solder paste and encapsulation method of high-power white light emitting diode module

Abstract

The invention discloses an encapsulation module of a high-power white light emitting diode (LED) and an encapsulation method of the high-power white light emitting diode, wherein chips are connected by nano silver solder paste; connection of pure silver formed after the nano silver solder paste is sintered has the advantages of high thermal and electrical conductivity, and the photoelectric conversion efficiency of the module can be improved; a prefabricated and moulded diaphragm is arranged at the periphery of each LED chip; the prefabricated and moulded diaphragm is adhered to a substrate connected with the high-power white light emitting diode chip by using silica gel; the arrangement mode of a square hole array on the prefabricated and moulded diaphragm is consistent with that of the LED chips; the area of each square hole is greater than that of the chip, and each LED chip is sleeved in the square hole, so that redundant glue flows into a gap between the prefabricated and moulded diaphragm and the LED chip during adhesive dispense so as to control dispense quantity. According to the invention, by utilizing the property that the nano silver solder paste becomes the pure silver after being sintered, the thermal resistance of the encapsulation module of the high-power white light emitting diode is reduced; the photoelectric conversion efficiency is improved; the encapsulation module is energy-saving and environment-friendly, and a foundation is built for the development of the high-power white light emitting diode in future.

Description

Technical field [0001] The invention relates to a high-power white light emitting diode (LED) packaging module and a packaging method thereof, and belongs to the improvement technology of a light emitting diode lighting device. Background technique [0002] The traditional high-power white LED module packaging method mainly consists of the following steps: 1. Chip connection; 2. Bonding alloy wire to connect the chip to realize circuit conduction; 3. Phosphor powder dispensing; 4. Plastic packaging. At present, the chip connection materials used in the market are all traditional tin, silver and copper materials, which have poor reliability after research and analysis, and because the traditional chip connection materials are not very good in thermal and electrical conductivity, the photoelectric conversion efficiency of their modules Also needs to be improved. New chip connection materials are needed to improve the overall performance of the module. And to control the dispensin...

AI Technical Summary

Problems solved by technology

Therefore, when the module is turned on, the color distribution of the prepared white LED will be uneven, and the side will tend to be yellowish, and because the flow of silica gel is unrestricted, the requirements for preparing the surface of the white LED are relatively high, and it is difficult to control using this method.

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