Si-Sb-Te based sulfur group compound phase-change material for phase change memory
A technology of phase change memory and chalcogenide, which is applied in the direction of electrical components, etc., can solve the problems of low power consumption in thermal stability operation, increase the complexity of manufacturing process, reduce the uniformity of device characteristics, etc., and achieve fast and reliable phase change The effect of improving performance and increasing the number of cycle operations
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[0023] The Si-Sb-Te base chalcogenide phase-change material for phase-change memory of the present invention, its component general formula is (Si a Sb b Te c ) 1-y m y , at Si a Sb b Te cAmong them, the content a of Si is 10-25% atomic percent, the ratio of the atomic percent of Sb and Te content is 1.7≤(b / c)≤2.0; the content y of doping element M is 0-25% atomic percent; It can be formed by various methods, such as sputtering, electron beam evaporation, vapor deposition, atomic layer deposition, and the like. When the sputtering method is used to prepare nitrogen and oxygen doped Si-Sb-Te-based chalcogenide phase change materials by reactive sputtering, the composition of nitrogen and oxygen elements in the material can be adjusted by adjusting the nitrogen and oxygen content. The flow rate is controlled; the remaining elements in the material (ie Si, Sb, and Te) can correspond to different targets, and the composition of the material can be controlled by applying dif...
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