Chip on board (COB) aluminum substrate with high reflectivity and good heat dissipation performance and manufacturing process thereof
A technology with high reflectivity and manufacturing process, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of low light utilization rate, affecting the consistency of light output direction, and difficult to guarantee the flatness of the bottom cup, so as to improve the reflectivity and The effect of light extraction efficiency, improving export rate and heat dissipation capacity, and improving heat dissipation effect
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[0032] The present invention will be further described below in conjunction with the accompanying drawings of the specification.
[0033] Such as figure 1 , 2 As shown, a COB aluminum substrate with high reflectivity and good heat dissipation. The aluminum substrate 1 is divided into a solid crystal region 12 and a non-solid crystal region 11. The solid crystal region 12 is provided with a groove 8, and the recess The groove 8 is provided with a copper block 6 for fixing the LED chip 7. The surface of the copper block 6 is flush with the surface of the aluminum substrate 1. The surface of the copper block 6 is provided with a nickel-plated layer 9, and the nickel-plated layer 9 is provided with a silver-plated layer 5. A layer of FR-4 composite circuit board 2 is provided on the non-bonding area 11, and the FR-4 composite circuit board 2 is formed by combining FR-4 fiberboard and a circuit layer provided on the surface thereof. The FR-4 composite circuit board 2 is provided with...
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