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Medium substrate based on composite material and manufacturing method thereof

A technology of a dielectric substrate and a manufacturing method, which is applied to a dielectric substrate of a composite material and its manufacturing field, can solve the problems of low dielectric constant and high loss, and achieve the effect of reducing loss

Active Publication Date: 2012-08-15
KUANG CHI INST OF ADVANCED TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Based on this, in order to solve the technical problems of low dielectric constant and high loss of existing composite materials and dielectric substrates based on composite materials, a dielectric substrate based on composite materials with high dielectric constant and low loss is provided

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  • Medium substrate based on composite material and manufacturing method thereof
  • Medium substrate based on composite material and manufacturing method thereof
  • Medium substrate based on composite material and manufacturing method thereof

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Embodiment Construction

[0043] Reference will now be made in detail to the embodiments depicted in the accompanying drawings. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods are not described in detail. procedures, components and circuits so as not to unnecessarily obscure the embodiments.

[0044] Please refer to figure 1 , is a schematic diagram of an embodiment of the composite material with high dielectric constant and low loss of the present invention. The composite material 10 includes a matrix material 101 , high dielectric constant powder particles 103 and an organic polymer material 102 wrapping the high dielectric constant powder particles 103 . The high dielectric constant powder particles 103 and the organic polym...

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Abstract

The invention discloses a medium substrate based on a composite material. The medium substrate comprises a first conductive foil and the composite material attached to the first conductive foil, wherein the composite material comprises a parent material, powder particles with high dielectric constant, and an organic polymer material for wrapping the powder particles with high dielectric constant, a core-shell structure is formed by the powder particles with high dielectric constant and the organic polymer material, the parent material and the organic polymer material are mutually immiscible, the core-shell structure is randomly and discretely distributed and embedded in the parent material, and the particle size of the powder particles with high dielectric constant is 0.1um-2um. The core-shell structure which takes high dielectric ceramic as a core and an organic polymer film as a shell, and a parent material solution are mixed in certain proportion to prepare a viscosity solution, and then the viscosity solution is baked and cured to enable the core-shell structure to be randomly and discretely distributed and embedded in the parent material, so that the loss of the formed composite material and the medium substrate based on the composite material can be reduced by 50% or more.

Description

technical field [0001] The invention relates to the field of composite materials, in particular to a dielectric substrate of composite material with high dielectric constant and low loss and a manufacturing method thereof. Background technique [0002] In communication systems, the size of electronic components is gradually developing towards high efficiency, multi-function and small size, which puts forward higher requirements for the performance of high-frequency materials. The rapid development of modern electronic information products, especially microwave radio frequency devices, the great improvement of integration and the application requirements of digitalization, high frequency and multifunctionality have challenged the general PTFE high frequency board and manufacturing process. [0003] At present, the high-frequency materials on the market mainly include PTFE substrate, thermosetting PPO, cross-linked polybutadiene substrate and epoxy resin composite substrate. ...

Claims

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Application Information

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IPC IPC(8): B32B15/08B32B27/04B32B37/15
Inventor 刘若鹏徐冠雄金曦
Owner KUANG CHI INST OF ADVANCED TECH
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