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Sealant for optical semiconductors and optical semiconductor device

A technology for optical semiconductor devices and sealants, which can be used in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., and can solve the problems of component adhesion, easy adhesion of dust, and sticky sealant cured products.

Inactive Publication Date: 2012-08-15
SEKISUI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the case of using the above-mentioned sealant containing a silicone resin, since the surface of the cured product of the sealant is sticky, there is a problem that impurities such as dust tend to adhere to the surface.
In addition, if the surface of the cured product is sticky, there are also problems such as sticking between components and sticking to the pick up nozzle during actual mounting, resulting in a significant decrease in the productivity of optical semiconductor devices.

Method used

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  • Sealant for optical semiconductors and optical semiconductor device
  • Sealant for optical semiconductors and optical semiconductor device
  • Sealant for optical semiconductors and optical semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0388] (Synthesis Example 1) Synthesis of the first silicone resins A and A-2

[0389] Into a 1000 mL detachable flask equipped with a thermometer, a dropping device, and a stirrer, add 63 g of trimethylmethoxysilane, 90 g of dimethyldimethoxysilane, 183 g of diphenyldimethoxysilane, and ethylene 133 g of trimethoxysilane was stirred at 50°C. A solution obtained by dissolving 0.8 g of potassium hydroxide in 114 g of water was slowly added dropwise thereto, and after the dropwise addition, it was stirred and reacted at 50° C. for 6 hours to obtain a reaction liquid. Then, 0.9 g of acetic acid was added to the reaction liquid, volatile components were removed under reduced pressure, and potassium acetate was removed by filtration to obtain a polymer (A).

[0390] The number average molecular weight (Mn) of the obtained polymer (A) was 1700. pass 29 As a result of identifying the chemical structure by Si-NMR, the polymer (A) has the following average composition formula (A1). ...

Synthetic example 2

[0395] (Synthesis Example 2) Synthesis of the first silicone resins A and A-2

[0396] To a 1000 mL detachable flask equipped with a thermometer, a dropping device, and a stirrer, 126 g of dimethyldimethoxysilane, 183 g of diphenyldimethoxysilane, 119 g of vinylmethyldimethoxysilane, and 79 g of 1,6-bis(dimethylmethoxysilyl)hexane were stirred at 50 degreeC. A solution obtained by dissolving 0.8 g of potassium hydroxide in 108 g of water was slowly added dropwise thereto, and after the dropwise addition, it was stirred and reacted at 50° C. for 6 hours to obtain a reaction liquid. Then, 0.9 g of acetic acid was added to the reaction liquid, volatile components were removed under reduced pressure, and potassium acetate was removed by filtration to obtain a polymer (B).

[0397] The number average molecular weight (Mn) of the obtained polymer (B) was 4100. As a result of identifying the chemical structure by 29Si-NMR, it was revealed that the polymer (B) had the following aver...

Synthetic example 3

[0401] (Synthesis Example 3) Synthesis of the first silicone resins A and A-2

[0402]To a 1000 mL detachable flask equipped with a thermometer, a dropping device, and a stirrer, 60 g of dimethyldimethoxysilane, 317 g of diphenyldimethoxysilane, 119 g of vinylmethyldimethoxysilane, and 79 g of 1,6-bis(dimethylmethoxysilyl)hexane were stirred at 50 degreeC. A solution obtained by dissolving 0.8 g of potassium hydroxide in 108 g of water was slowly added dropwise thereto, and after the dropwise addition, it was stirred and reacted at 50° C. for 6 hours to obtain a reaction liquid. Then, 0.9 g of acetic acid was added to the reaction liquid, volatile components were removed under reduced pressure, and potassium acetate was removed by filtration to obtain a polymer (C).

[0403] The number average molecular weight (Mn) of the obtained polymer (C) was 3600. pass 29 As a result of identification of the chemical structure by Si-NMR, the polymer (C) has the following average compos...

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Abstract

Disclosed is a sealant for optical semiconductors that has high-level gas barrier properties for corrosive gases and does not easily crack or peel even when used in a harsh environment. Specifically disclosed is a sealant for optical semiconductors that contains at least one first silicone resin component out of a first silicone resin A represented by formula (1A) having aryl groups and alkenyl groups without having hydrogen atoms bonded to silicon atoms and a first silicone resin B represented by formula (1B) having aryl groups and alkenyl groups without hydrogen items bonded to silicon atoms, at least one second silicone resin component out of a second silicone resin A represented by formula (51A) and having aryl groups and hydrogen atoms, which are directly bonded to silicon atoms, anda second silicone resin B represented by formula (51B) having aryl groups and hydrogen atoms, which are directly bonded to silicon atoms, and a hydrosilylation catalyst.

Description

technical field [0001] The present invention relates to an optical semiconductor device sealing agent for sealing an optical semiconductor element in an optical semiconductor device, and an optical semiconductor device using the optical semiconductor device sealing agent. Background technique [0002] Optical semiconductor devices such as light emitting diode (LED) devices have low power consumption and long life. In addition, optical semiconductor devices can also be used in harsh environments. Therefore, optical semiconductor devices have been widely used in backlights for mobile phones, backlights for liquid crystal televisions, lamps for automobiles, lighting fixtures, signboards, and the like. [0003] When an optical semiconductor element (for example, LED) which is a light emitting element used in an optical semiconductor device is in direct contact with the atmosphere, moisture or suspended dust in the atmosphere will cause the light emitting characteristics of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08L83/14H01L23/29H01L23/31H01L33/56
CPCH01L23/296H01L33/56H01L2924/12044C08G77/12C08G77/20C08L83/04C08G77/52C08L83/14C08G77/80H01L2924/0002H01L2924/00C08G77/04H01L23/29
Inventor 谷川满渡边贵志森口慎太郎乾靖国广良隆山崎亮介沖阿由子家田泰享金千鹤小林佑辅
Owner SEKISUI CHEM CO LTD