Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof

Abstract

An abrasive article includes an elongated body, a bonding layer including a metal overlying a surface of the elongated body, and a coating layer including a polymer material overlying the boding layer. The abrasive article further includes abrasive grains contained within the bonding layer and coating layer, and wherein the bonding layer comprises an average thickness (tbl) at least about 40% of the average grit size of the abrasive grains.

Description

technical field [0001] The following is directed to abrasive articles, and in particular abrasive articles comprising abrasive grains secured to an elongate body. Background technique [0002] Over the past century, a variety of abrasive tools have been developed for the general function of removing material from workpieces for various industries including, for example, sawing, drilling, polishing, cleaning, engraving, and grinding. Particularly relevant to the electronics industry are abrasive tools suitable for slicing single crystal ingots of material into wafers, eg silicon wafers. As the industry matures, these ingots have larger and larger diameters, and due to factors such as throughput, productivity, layers affected, size constraints, etc., it becomes acceptable to use loose abrasives and wire saws for this type of work. [0003] Wire saws include abrasive tools that include abrasive particles attached to a long distance of wire that can be wound at high speeds to p...

AI Technical Summary

Problems solved by technology

Unfortunately, resin wire saw bonds tend to wear out quickly and the abrasive is lost in large quantities before reaching the useful life of the pellets

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