Chip reinforced boiling heat transfer structure of multi-pore microcolumn variable camber molded surfaces

Abstract

The invention relates to an ultra-high heat-flow density reinforced boiling heat transfer technology, in particular to a chip reinforced boiling heat transfer structure of multi-pore microcolumn variable camber molded surfaces, which is suitable for an ultra-high heat-flow density micro-electronic chip efficiently-cooling technology. The chip reinforced boiling heat transfer structure comprises a heat radiating plate on the surface of a chip, and a plurality of multi-pore variable camber molded surface three-dimensional microstructures formed on the heat radiating plate by using foam metal, wherein the multi-pore variable camber molded surface three-dimensional microstructures are arranged in an array form and are of a six-faced shape, the upper surfaces and the lower surfaces of the multi-pore variable camber molded surface three-dimensional microstructures are squares with different sizes, and four side surfaces of the multi-pore variable camber molded surface three-dimensional microstructures are arc surfaces with same shapes. According to the chip reinforced boiling heat transfer structure, enough steam bubble nucleuses of boiling and large specific surface area as well as high heat transfer efficiency are provided, the problem of interaction of a suction function of a capillary pump and synchronous increasing or synchronous reducing of a fluid flow resistance is effectively solved, therefore, ultra-high heat-flow density nucleate boiling heat transfer is remarkably improved, thus effective heat transfer of an ultra-high critical heat-flow density micro-electronic device is ensured.

Description

technical field [0001] The invention relates to an ultra-high heat flux density boiling enhanced heat exchange technology, in particular to a high-efficiency cooling technology suitable for ultra-high heat flux density microelectronic chips, in particular to a chip enhanced boiling heat exchange structure with a porous micro-pillar variable curvature profile. Background technique [0002] With the rapid development of MEMS microelectronic machining technology, the requirements for high frequency, high speed and high integration of electronic components are getting higher and higher. The high temperature working environment will inevitably affect the performance of electronic components, which requires more Efficient cooling to meet its requirements. Therefore, effectively solving the heat dissipation problem of electronic components has become a key technology in the current electronic components and electronic equipment manufacturing. [0003] At present, the use of liquid...

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Problems solved by technology

Therefore, many researchers focus on the slotting method of porous surface mainly to open rectangular micro-grooves on the surface of the porous structure, and increase the effective area of ​​capillary action to improve the heat transfer of nucleate boiling. However, for the ultra-high heat flux boiling area, the heat transfer on the surface of the heating element deteriorates, and the heat flux value increases linearly with the superheat degree of the wall surface, and the study found that the critical heat flux has the same relationship wit

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