Flat-grid electric charge storage type IGBT (insulated gate bipolar translator)
A charge storage and charge storage layer technology, applied in circuits, electrical components, semiconductor devices, etc., can solve the problems of small device breakdown voltage and reduced device breakdown voltage, and achieve the effect of good breakdown voltage and optimized compromise
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[0019] A planar gate charge storage type IGBT, such as Figure 2 to Figure 3 shown, including P + collector 12, located at P + The metal collector 11 on the back of the collector 12 is located at P + The N on the front of the collector 12 + Electric field blocking layer 13, located at N + N on the surface of the electric field stop layer 13 - Drift zone 14, located at N - The P-type base region 20 in the middle of the top of the drift region 14, and the two Ns located inside the P-type base region 20 + The contact region 19 is located inside the P-type base region 20 and is located between the two N + P between the contact area 19 + Contact region 18, located on the device surface and connected to two N + Contact zone 19 and P + The metal emitter 17 contacted by the contact region 18 is located on the surface of the device and is connected to the two N + Contact region 19, P-type base region 20 and N - The gate oxide layer 15 in contact with the drift region 14, the...
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