Flexible circuit board, chip on film and manufacturing method

A technology of flexible circuit boards and chip-on-chips, which is applied in the fields of printed circuit manufacturing, printed circuits, and printed circuits, and can solve problems such as difficulty in overlapping lead wires of chip-on-chip liquid crystal panels, large expansion coefficients, and abnormal signal transmission.

Inactive Publication Date: 2012-09-19
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The problem of the prior art is: the expansion coefficient of the colloidal material between the leads on flexible circuit boards such as chip-on-chip films is large, and the huge heat of the pressure head during thermal bonding will cause the leads to no longer b

Method used

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  • Flexible circuit board, chip on film and manufacturing method
  • Flexible circuit board, chip on film and manufacturing method
  • Flexible circuit board, chip on film and manufacturing method

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Embodiment Construction

[0028] The present invention will be further described below in conjunction with the accompanying drawings and preferred embodiments.

[0029] The present invention provides a new type of flexible circuit board. This implementation mode takes chip-on-film as an example to further illustrate the concept of the present invention:

[0030] Such as Figure 2~3 As shown, the liquid crystal panel is provided with a plurality of criss-cross scan lines and data lines, and the distance between the scan lines and data lines at the edge of the liquid crystal panel 100 will be narrowed to form a plurality of lead lines. The COF 200 of the present invention comprises an insulating substrate 210 with elongated edges, an IC 230 is provided on the insulating substrate 210, pins 220 are arranged at both ends of the IC, and the pins 220 extend to two long sides of the insulating substrate 210 On the other hand, the pins of the chip-on-chip film 200 used for hot-pressing with the liquid crystal...

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Abstract

The invention discloses a flexible circuit board, a chip on film and a manufacturing method. The flexible circuit board for hot pressing comprises an insulating substrate with a strip edge; multiple pins for hot pressing are arranged on the insulating substrate; the flexible circuit board is characterized in that the pins for hot pressing are arranged along the strip edge of the insulating substrate from the two ends to the middle; and the space between adjacent two pins is gradually reduced. In the invention, after heat bonding, the spaces among the pins can be basically kept consistent, being equivalent to the expansion result of a liquid crystal panel, and thus sound electrical connection between the pins and the lead of the liquid crystal panel is guaranteed, and the electrical contact is more reliable.

Description

technical field [0001] The invention relates to the field of liquid crystal display, and more specifically relates to a flexible circuit board, a chip-on-chip film and a manufacturing method. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit Board), also known as "soft board", is a printed circuit made of a flexible insulating substrate, which has many advantages that rigid printed circuit boards do not have. For example, it can be freely bent, wound, and folded, and can be arranged arbitrarily according to the requirements of the spatial layout, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. The use of flexible circuit boards can greatly reduce the volume of electronic products, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widel...

Claims

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Application Information

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IPC IPC(8): H05K1/11H05K3/00G02F1/133G02F1/13
CPCG02F1/13H05K3/00H05K1/11G02F1/133H05K1/118H05K3/323H05K3/361H05K2201/10136H05K2201/10681
Inventor 谭小平吴宇
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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