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A kind of processing method of metamaterial

A processing method and technology of metamaterials, applied in the field of metamaterials, can solve the problems of reducing the performance of metamaterials and the large gap in the dimensional accuracy of artificial microstructures, and achieve the effects of improving performance, overcoming over-etching problems, and improving manufacturing accuracy.

Active Publication Date: 2015-12-09
KUANG CHI INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Metamaterial artificial microstructures can be processed using traditional PCB processing technology, but in the process of processing artificial microstructures using PCB subtraction processing technology, due to the etching process, the sharp corners of the etched artificial microstructures are inevitable. There is an over-etching phenomenon, which causes a large gap between the dimensional accuracy of the processed product and the actually designed artificial microstructure, which greatly reduces the performance of the metamaterial

Method used

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  • A kind of processing method of metamaterial
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  • A kind of processing method of metamaterial

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] 101. Design artificial microstructure 1, the shape of artificial microstructure 1 is as follows Figure 5 As shown, the predetermined thickness of the copper artificial microstructure layer of the metamaterial is 18 μm, and a plurality of copper artificial microstructures 1 arranged in a periodic array on the surface of the copper clad laminate 2 are obtained by using a chemical etching process, and the copper thickness is 3 μm.

[0040] 102. Coating the copper artificial microstructure plate with a layer of anti-plating dry film 3, the thickness of the anti-plating dry film 3 is 75 μm, the thickness of the photoresist layer of the anti-electroplating dry film is 25 μm, and polishing the anti-plating dry film 3 until exposed The upper surface of the copper artificial microstructure 1 .

[0041] 103. Electroplate a layer of the same copper artificial microstructure 1 on the upper surface of the copper artificial microstructure 1, repeat steps 102 and 103 four times each,...

Embodiment 2

[0043] 101. Design artificial microstructure 1, the shape of artificial microstructure 1 is as follows Image 6 As shown, the predetermined thickness of the copper artificial microstructure layer of the metamaterial is 36 μm, and a plurality of copper artificial microstructures 1 arranged in a periodic array on the surface of the copper clad laminate 2 are obtained by using a chemical etching process, and the copper thickness is 12 μm.

[0044] 102. Coating the copper artificial microstructure plate with a layer of anti-plating dry film 3, the thickness of the anti-plating dry film 3 is 90 μm, the thickness of the photoresist layer of the anti-electroplating dry film is 50 μm, and polishing the anti-plating dry film 3 until exposed The upper surface of the copper artificial microstructure 1 .

[0045] 103. Electroplate a layer of the same copper artificial microstructure 1 on the upper surface of the copper artificial microstructure 1, repeat steps 102 and 103 each once, and o...

Embodiment 3

[0047] 101. Design artificial microstructure 1, the shape of artificial microstructure 1 is as follows Figure 7 As shown, the predetermined thickness of the copper artificial microstructure layer of the metamaterial is 80 μm, and a plurality of copper artificial microstructures 1 arranged in a periodic array on the surface of the copper clad laminate 2 are obtained by using a chemical etching process, and the copper thickness is 10 μm.

[0048] 102. Coating the copper artificial microstructure plate with a layer of anti-plating dry film 3, the thickness of the anti-plating dry film 3 is 110 μm, the thickness of the photoresist layer of the anti-electroplating dry film is 50 μm, and polishing the anti-plating dry film 3 until exposed The upper surface of the copper artificial microstructure 1 .

[0049] 103. Electroplate a layer of the same copper artificial microstructure 1 on the upper surface of the copper artificial microstructure 1, repeat steps 102 and 103 six times each...

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Abstract

The invention provides a metamaterial processing method, comprising steps that: 101. An artificial micro structure is designed. By using a chemical etching process or a plating process, a copper artificial micro-structural panel with a predetermined arrangement rule is obtained; 102. The copper artificial micro-structural panel is coated with a layer of anti-plating dry film. The anti-plating dry film is grinded until an upper surface of the copper artificial micro structure exposes; 103. The upper surface of the copper artificial micro structure is plated with a layer of the same copper artificial micro structure, and the metamaterial having a predetermined thickness is obtained. The processing method effectively overcomes an over-etching problem caused in the artificial micro structure etching process, improves machining accuracy of the metamaterial, has simple processing method and production process, greatly reduces copper pollution towards water body and has good development prospect.

Description

technical field [0001] The invention relates to the field of metamaterials, in particular to a processing method for metamaterials. Background technique [0002] Metamaterials refer to some artificial composite structures or composite materials with extraordinary physical properties that natural materials do not have. Through the orderly design of the structure on the key physical scale of the material, the limitation of some apparent natural laws can be broken through, so as to obtain the supernormal material function beyond the ordinary nature inherent in nature. The properties and functions of metamaterials are mainly derived from their internal structure rather than the materials from which they are composed. [0003] Metamaterials are a highly interdisciplinary new field that integrates electromagnetics, microwaves, terahertz, photonics, advanced engineering design, communications and other sciences. As a cutting-edge emerging interdisciplinary science and technology,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00
Inventor 刘若鹏栾琳郭洁杨宗荣
Owner KUANG CHI INST OF ADVANCED TECH