Liquid epoxy resin composition for packaging LED (Light Emitting Diode)

A liquid epoxy resin, LED packaging technology, used in semiconductor devices, electrical components, circuits, etc., can solve the problems of poor flexibility and crack resistance of cured products

Inactive Publication Date: 2012-10-03
JIAXING JIAGANG SYNTHETIC MATERIALS
View PDF3 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This epoxy resin composition has a lower viscosity before curing, and has a higher glass transition temperature a

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Liquid epoxy resin composition for packaging LED (Light Emitting Diode)
  • Liquid epoxy resin composition for packaging LED (Light Emitting Diode)
  • Liquid epoxy resin composition for packaging LED (Light Emitting Diode)

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1（A

[0026] Synthesis Example 1 (Agent 1): Add 1800 grams of bisphenol A epoxy resin (R139S manufactured by Mitsui Chemicals, epoxy equivalent 190g / eq) in a 5L stainless steel reactor with electric heating and vacuum device, and heat up to After reaching 80°C, add 200 grams of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate (Hubei Xinjing New Material Co., Ltd., epoxy equivalent 130g / eq), defoamer 2 Gram (Deqian Chemical 5300), stir evenly and heat up to 110°C, keep the temperature, vacuumize for more than 30 minutes while stirring (vacuum degree to 3 Torr), cool to 60°C and discharge.

Synthetic example 2（A

[0027] Synthesis Example 2 (Agent 2): Add 1600 grams of bisphenol A epoxy resin (R139S manufactured by Mitsui Chemicals, epoxy equivalent 190g / eq) into a 5L stainless steel reactor with electric heating and vacuum device, and heat up to After reaching 80°C, add 400 grams of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate (Hubei Xinjing New Material Co., Ltd., epoxy equivalent 130g / eq), defoamer 2 Gram (Deqian Chemical 5300), stir evenly and heat up to 110°C, keep the temperature, vacuumize for more than 30 minutes while stirring (vacuum degree to 3 Torr), cool to 60°C and discharge.

Synthetic example 3（B

[0028] Synthesis Example 3 (Agent B 1): Add 1930 grams of methylhexahydrophthalic anhydride (MEHHPA produced by Zhejiang Platino Chemical Co., Ltd.) into a 5L stainless steel reactor with electric heating and vacuum device, and heat up to 80°C Finally, add 10 grams of N,N-dimethylbenzylamine (manufactured by Changzhou Yuexin Chemical), 50 grams of neopentyl glycol (manufactured by Korea LG Chemicals), antioxidant 2,6-di-tert-butyl-4-methyl 1 gram of base phenol (manufactured by Jinan Genesis Chemical Industry Co., Ltd.), 1 gram of ultraviolet absorber 2-hydroxy-4-methoxybenzophenone (manufactured by Jinyicheng Fine Chemical Industry Co., Ltd., Xiangfan City) was heated to 100 ° C while stirring, and the temperature was maintained. While stirring, vacuumize for more than 30 minutes (vacuum degree to 31orr), cool to 60°C and discharge.

[0029] Synthesis Example 4 (Agent B 2): Add 1900 grams of methylhexahydrophthalic anhydride (MEHHPA produced by Zhejiang Platino Chemical Co., ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Epoxy equivalentaaaaaaaaaa
Epoxy equivalentaaaaaaaaaa
Login to view more

Abstract

The invention discloses a liquid epoxy resin composition for packaging an LED (Light Emitting Diode). The liquid epoxy resin composition consists of an agent A and an agent B, wherein the agent A comprises 97-99 percent by weight of epoxy resin composition and 1-3 percent by weight of defoaming agent; the agent B comprises 94-97 percent by weight of alicyclic anhydride, 0.02-0.1 percent by weight of antioxidant, 0.02-0.1 percent by weight of ultraviolet absorber, 2-5 percent by weight of toughening modifier and 0.5-1.5 percent by weight of accelerator; and the weight ratio of the agent A to the agent B is 100:(100-105). The epoxy resin composition in the agent A is bisphenol-A epoxy resin and 3,4-epoxy cyclohexylmethyl and 3,4-epoxycyclohexyl carboxylate; and the alicyclic anhydride in the agent B is at least one of methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride and hexahydrophthalic anhydride; and the toughening modifier is neopentyl glycol. The neopentyl glycol has a structure of a branched chain, so that the flexibility and the cracking resistance of the cured epoxy resin are remarkably improved.

Description

technical field [0001] The invention relates to a liquid resin for LED packaging, a liquid epoxy resin composition for LED packaging. Background technique [0002] Ordinary liquid epoxy resin for LED packaging has high viscosity (above 10000CPS at room temperature) and low glass transition temperature (about 110°C), which is difficult to meet the requirements of high-power LED lamps. [0003] Chinese patent CN201010166012 discloses an epoxy resin composition, which is composed of A glue and B glue. It is made by mixing phenolic epoxy resins; B glue includes acid anhydride curing agent, curing accelerator, curing modifier and antioxidant, wherein the curing modifier adopts the structural formula OH-(CH 2 )n-OH (n=2-12) diol organic compounds. This epoxy resin composition has a lower viscosity before curing and a higher glass transition temperature after curing. However, the cured product has poor flexibility and cracking resistance, and needs to be improved. Contents of t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C08L63/02C08L63/00C08K5/053H01L33/56
Inventor 邹伟丰
Owner JIAXING JIAGANG SYNTHETIC MATERIALS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap