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Liquid epoxy resin composition for packaging LED (Light Emitting Diode)

A liquid epoxy resin, LED packaging technology, used in semiconductor devices, electrical components, circuits, etc., can solve the problems of poor flexibility and crack resistance of cured products

Inactive Publication Date: 2012-10-03
JIAXING JIAGANG SYNTHETIC MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This epoxy resin composition has a lower viscosity before curing, and has a higher glass transition temperature after curing. However, the flexibility and crack resistance of the cured product are poor and need to be improved.

Method used

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  • Liquid epoxy resin composition for packaging LED (Light Emitting Diode)
  • Liquid epoxy resin composition for packaging LED (Light Emitting Diode)
  • Liquid epoxy resin composition for packaging LED (Light Emitting Diode)

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1（A

[0026] Synthesis Example 1 (Agent 1): Add 1800 grams of bisphenol A epoxy resin (R139S manufactured by Mitsui Chemicals, epoxy equivalent 190g / eq) in a 5L stainless steel reactor with electric heating and vacuum device, and heat up to After reaching 80°C, add 200 grams of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate (Hubei Xinjing New Material Co., Ltd., epoxy equivalent 130g / eq), defoamer 2 Gram (Deqian Chemical 5300), stir evenly and heat up to 110°C, keep the temperature, vacuumize for more than 30 minutes while stirring (vacuum degree to 3 Torr), cool to 60°C and discharge.

Synthetic example 2（A

[0027] Synthesis Example 2 (Agent 2): Add 1600 grams of bisphenol A epoxy resin (R139S manufactured by Mitsui Chemicals, epoxy equivalent 190g / eq) into a 5L stainless steel reactor with electric heating and vacuum device, and heat up to After reaching 80°C, add 400 grams of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate (Hubei Xinjing New Material Co., Ltd., epoxy equivalent 130g / eq), defoamer 2 Gram (Deqian Chemical 5300), stir evenly and heat up to 110°C, keep the temperature, vacuumize for more than 30 minutes while stirring (vacuum degree to 3 Torr), cool to 60°C and discharge.

Synthetic example 3（B

[0028] Synthesis Example 3 (Agent B 1): Add 1930 grams of methylhexahydrophthalic anhydride (MEHHPA produced by Zhejiang Platino Chemical Co., Ltd.) into a 5L stainless steel reactor with electric heating and vacuum device, and heat up to 80°C Finally, add 10 grams of N,N-dimethylbenzylamine (manufactured by Changzhou Yuexin Chemical), 50 grams of neopentyl glycol (manufactured by Korea LG Chemicals), antioxidant 2,6-di-tert-butyl-4-methyl 1 gram of base phenol (manufactured by Jinan Genesis Chemical Industry Co., Ltd.), 1 gram of ultraviolet absorber 2-hydroxy-4-methoxybenzophenone (manufactured by Jinyicheng Fine Chemical Industry Co., Ltd., Xiangfan City) was heated to 100 ° C while stirring, and the temperature was maintained. While stirring, vacuumize for more than 30 minutes (vacuum degree to 31orr), cool to 60°C and discharge.

[0029] Synthesis Example 4 (Agent B 2): Add 1900 grams of methylhexahydrophthalic anhydride (MEHHPA produced by Zhejiang Platino Chemical Co., ...

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Abstract

The invention discloses a liquid epoxy resin composition for packaging an LED (Light Emitting Diode). The liquid epoxy resin composition consists of an agent A and an agent B, wherein the agent A comprises 97-99 percent by weight of epoxy resin composition and 1-3 percent by weight of defoaming agent; the agent B comprises 94-97 percent by weight of alicyclic anhydride, 0.02-0.1 percent by weight of antioxidant, 0.02-0.1 percent by weight of ultraviolet absorber, 2-5 percent by weight of toughening modifier and 0.5-1.5 percent by weight of accelerator; and the weight ratio of the agent A to the agent B is 100:(100-105). The epoxy resin composition in the agent A is bisphenol-A epoxy resin and 3,4-epoxy cyclohexylmethyl and 3,4-epoxycyclohexyl carboxylate; and the alicyclic anhydride in the agent B is at least one of methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride and hexahydrophthalic anhydride; and the toughening modifier is neopentyl glycol. The neopentyl glycol has a structure of a branched chain, so that the flexibility and the cracking resistance of the cured epoxy resin are remarkably improved.

Description

technical field [0001] The invention relates to a liquid resin for LED packaging, a liquid epoxy resin composition for LED packaging. Background technique [0002] Ordinary liquid epoxy resin for LED packaging has high viscosity (above 10000CPS at room temperature) and low glass transition temperature (about 110°C), which is difficult to meet the requirements of high-power LED lamps. [0003] Chinese patent CN201010166012 discloses an epoxy resin composition, which is composed of A glue and B glue. It is made by mixing phenolic epoxy resins; B glue includes acid anhydride curing agent, curing accelerator, curing modifier and antioxidant, wherein the curing modifier adopts the structural formula OH-(CH 2 )n-OH (n=2-12) diol organic compounds. This epoxy resin composition has a lower viscosity before curing and a higher glass transition temperature after curing. However, the cured product has poor flexibility and cracking resistance, and needs to be improved. Contents of t...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08L63/00C08K5/053H01L33/56
Inventor 邹伟丰
Owner JIAXING JIAGANG SYNTHETIC MATERIALS
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