Pure copper plate production method, and pure copper plate

Abstract

Disclosed is a production method for a pure copper plate having a fine crystal structure, a suitable hardness, and a high special grain boundary length ratio. Further disclosed is a pure copper plate which is obtained according to the disclosed production method and which is for targets for sputtering, or anodes for plating, or similar. A pure copper ingot having a purity level of 99.96 weight% or higher is heated to 550-800 DEG C. A hot-rolling process is carried out wherein the rolling rate is 80% or higher and the temperature at rolling completion is 500-700 DEG C. Next, rapid cooling from the rolling completion temperature to 200 DEG C or less is carried out at a cooling speed of 200-1000 DEG C / min, followed by cool rolling at a rolling rate of 5-24%, and annealing.

Description

Technical field [0001] The present invention relates to a method for producing a pure copper plate with good quality, and in particular to a method having a fine crystal structure, an appropriate hardness, and a twin crystal structure formed by partial recrystallization to give a high special grain boundary length ratio A manufacturing method of a pure copper plate, and a pure copper plate of raw materials such as a sputtering target or an anode for electroplating manufactured by the manufacturing method. [0002] This application claims priority based on Japanese Patent Application No. 2010-26453 for which it applied on February 9, 2010, and the content is quoted here. Background technique [0003] The pure copper plate is generally manufactured as follows: after hot rolling or hot forging a pure copper ingot, cold rolling or cold forging is performed, and then a heat treatment for strain relief or recrystallization is performed, thereby manufacturing a pure copper plate. This ki...

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Problems solved by technology

[0013] However, in the existing method of industrially producing a large-sized pure copper plate with a uniform and stable crystal structure, it is necessary to perform hot forging or hot rolling on the pure copper ingot, and then perform cold forging or cold rolling, and heat treatment. However, when the above-mentioned pure copper plate is used in a sputtering target, an anode for electroplating, or an exothermic substrate, etc., the suppression of abnormal discharge during long-term sputtering in the sputtering target and the improvement of the uniformity of in-plane dissolution in the anode for electroplating Or heat-dissipating substrates have properties such as thermal fatigue resistance, which are difficult to deal with only by miniaturization.

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