Unlock instant, AI-driven research and patent intelligence for your innovation.

Flux composition for lead-free solder and lead-free solder paste

A technology of lead-free solder and composition, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., to achieve excellent storage stability, inhibit viscosity increase, and excellent wettability

Inactive Publication Date: 2015-08-12
ARAKAWA CHEM IND LTD
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, however, the use of this activator creates another problem: during storage and during manufacturing processes other than soldering, such as in printing, etc., a reaction between the solder particles and the activator component in the flux proceeds
However, this proposed solder still leaves room for improvement in satisfying both storage stability and wettability suitable for reflow in an atmospheric atmosphere.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flux composition for lead-free solder and lead-free solder paste
  • Flux composition for lead-free solder and lead-free solder paste
  • Flux composition for lead-free solder and lead-free solder paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] The flux composition was prepared so that it had the composition shown in Example 1 of Table 1. In particular, a flux composition for lead-free solder is prepared by mixing: 2% by weight of 2-butene-1,4-diol (manufactured by Tokyo Chemical Industry Co., Ltd.), 1.6% by weight as bromine-based active Trans-2,3-dibromo-1,4-butenediol (manufactured by Tokyo Chemical Industry Co., Ltd.), 44% by weight of acrylic modified rosin (manufactured by Arakawa Chemical Industry Co., Ltd.) as a base resin , 0.5% by weight of pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)acrylate] (Irganox 1010, manufactured by Ciba Japan Co., Ltd.) as an antioxidant, and 34.9% by weight as a solvent Hexyl diethylene glycol (manufactured by Nippon Emulsifier Co., Ltd.), 3% by weight of sebacic acid (manufactured by Tokyo Chemical Industry Co., Ltd.) as the active agent, and 6% by weight of hydrogenated dimer acid (PRIPOL 1010, (Manufactured by Ukima Co., Ltd.), 12-hydroxystearic acid et...

Embodiment 2

[0064] Except that the amount of trans-2,3-dibromo-1,4-butenediol (manufactured by Tokyo Chemical Industry Co., Ltd.) as a bromine-based activator was changed to 0.8% by weight, and acrylic acid as the base resin Except that the amount of modified rosin (manufactured by Arakawa Chemical Industry Co., Ltd.) was changed to 44.8% by weight, a lead-free solder paste was obtained in the same manner as in Example 1. Table 3 shows the evaluation results of wettability and storage stability and the bromine content.

Embodiment 3

[0066] Except that the amount of 2-butene-1,4-diol (manufactured by Tokyo Chemical Industry Co., Ltd.) was changed to 8% by weight, and the amount of hexyl diethylene glycol (manufactured by Nippon Emulsifier Co., Ltd.) as a solvent Except for changing to 28.9% by weight, a lead-free solder paste was obtained in the same manner as in Example 1. Table 3 shows the evaluation results of wettability and storage stability and the bromine content.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A flux composition for a lead-free solder, which has a bromine or chlorine content of 500 to 30000 ppm relative to the total amount of the flux composition and contains a carbon-carbon double bond compound having a specific structure in an amount of 1 to 10 wt% relative to the total amount of the flux composition, wherein the carbon-carbon double bond compound is preferably at least one compound selected from the group consisting of 2-buten-1,4-diol, 2-hepten-1-ol and 5-hexen-1-ol.

Description

Technical field [0001] The present invention relates to a flux composition for lead-free solder and a lead-free solder paste. Background technique [0002] Flux is a material used to solder electronic components such as ICs, capacitors, and resistors to printed circuit boards. Flux is usually composed of ingredients such as base resin, active agent and solvent. For surface mounting of electronic parts, a substance called a cream solder composition (solder paste) is often used, which is a paste (paste) obtained by kneading a flux composition and solder powder. Because of its printability and adhesion, solder paste is suitable for automated soldering and its usage has increased in recent years. [0003] The solder paste is applied to the printed circuit board by screen printing or with a dispenser, and electronic components are mounted thereon. Then, the substrate is reflowed and heated, thereby fixing the electronic components on the mounting substrate. The term "reflow" herein ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363
CPCB23K35/3618B23K35/362
Inventor 岩村荣治久保夏希长坂进介
Owner ARAKAWA CHEM IND LTD