Silicon-based micro-heating plate provided with embedded heating wire, and processing method thereof

A heating wire and embedded technology, which is applied in the field of silicon-based micro-hot plates, achieves good processing technology, reduces the stress of warping and deformation, and relieves the effect of heating wire deformation

Active Publication Date: 2012-10-17
有光(常州)电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is to provide a silicon-based micro-hot plate film structure embedded with heating wires, which can reduce the warping of the micro-hot plate under high-temperature working conditions through the confining effect of the dense medium around the heating wires on the heating wires Deformation stress, and alleviate the failure of heating wire deformation caused by electromigration, improve the stability of the micro-hot plate under high-temperature working conditions, thereby providing a reliable heat source for micro-gas sensors and other devices; at the same time, the film structure can meet the requirements of traditional MEMS Processing technology requirements are conducive to the realization of micro-hot plate sample preparation and experiments

Method used

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  • Silicon-based micro-heating plate provided with embedded heating wire, and processing method thereof
  • Silicon-based micro-heating plate provided with embedded heating wire, and processing method thereof
  • Silicon-based micro-heating plate provided with embedded heating wire, and processing method thereof

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Embodiment Construction

[0029] exist figure 1 In the structure, the heating wire layer 4 is simply attached to the lower insulating layer, and is only constrained by the upper insulating layer 1, while the upper insulating layer can only be prepared by deposition method, the structure is loose, and it is easy to damage and fail.

[0030] figure 2 , the heating wire layer 4 is embedded inside the lower insulating layer 2, since the lower insulating layer (SiO 2 thermal oxidation method) has a compact structure, high strength, and is not easy to damage, so that it can effectively limit the heating wire layer 4 embedded in it; at the same time, under the condition of electrification, the electromigration effect of the heating wire layer will cause the thickness of the heating wire Inhomogeneous changes lead to device failure, and the confinement of the surrounding dense insulating layer can effectively weaken the influence of the electromigration effect.

[0031] Such as image 3 As shown, a specifi...

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Abstract

The invention discloses a silicon-based micro-heating plate provided with an embedded heating wire, and a processing method of the silicon-based micro-heating plate; and the micro-heating plate is prepared by silicon-based material and can be easily realized by a processing technology of a micro-electromechanical system (MEMS). The silicon-based micro-heating plate and the processing method are characterized in that based on the traditional 'sandwich' structure, the heating wire is embedded into a substrate insulating film layer, so that the influence to the stability of a device caused by thermal stress generated by the mismatch between the heating wire and the coefficient of thermal expansion of the insulating film layer can be reduced by the restraining function of the surrounding dense insulating film layer for the heating wire, and the influence of electromigration to the deformation of the heating wire can be effectively relieved; and therefore, the stability of the micro-heating plate can be improved during high-temperature work.

Description

technical field [0001] The invention relates to a silicon-based micro hotplate (micro hotplate) based on MEMS (micro-electromechanical system) technology and a processing method thereof. in micro devices. Background technique [0002] As we all know, with the development of industrialization, the concentration of greenhouse gases such as carbon dioxide, chlorofluorocarbons, methane, low-altitude ozone and nitrogen oxides in the atmosphere continues to increase, and the resulting greenhouse effect has caused significant changes in climate. In addition to the above-mentioned common greenhouse gases, other gases harmful to human body, such as aromatic gases (mainly benzene), have also attracted more and more attention. These harmful gases will be released along with industrial waste gas and automobile exhaust, and enter the air, causing adverse effects on people's health. [0003] In summary, the monitoring and control of greenhouse gases (such as CO2, etc.) and other harmful...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00B81C1/00
Inventor 王海容张欢孙全涛陈磊蒋庄德
Owner 有光(常州)电子科技有限公司
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