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Opener for extreme ultra violet lithography reticle pods

A switch and lithography technology, applied in the field of exposure process equipment, can solve problems such as affecting the production of integrated circuits on wafers, affecting the production of printed products, and pollution

Active Publication Date: 2012-10-24
SHANGHAI FORTREND TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Contamination of the patterned glass surface of a photomask by particles immediately affects the production of printed products, that is, the production of integrated circuits (ICs) on wafers
Elimination of the pellicle allows the mask to be used for 22nm or narrower linewidth lithography printing, but at the same time creates the problem of keeping the bare glass mask from contamination by particles when storing and transporting it

Method used

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  • Opener for extreme ultra violet lithography reticle pods
  • Opener for extreme ultra violet lithography reticle pods
  • Opener for extreme ultra violet lithography reticle pods

Examples

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Embodiment Construction

[0056] The two-stage EUV pod switcher of the present invention is a design of existing switchers, which are marketed by Fortrend Engineering Corporation respectively: Figure 3A marked with serial number 42 for opening and closing the SEMI standard E-19.4 200 mm RSP 32; or Figure 3B Marked with serial number 44, it is used to open and close the SEMI standard E-100 150 mm RSP 34.

[0057] The standard Fortrend Engineering Corporation RSP case opener 42, 44 design adds a second stage mechanism for opening the inner metal case 20 after opening the RSP 32, 34. In other words, the EUV pod switcher of the present invention has a secondary component. The first component (existing RSP box openers 42, 44) is the mechanism for opening the RSP 32, 34; the second component, an inner shell opener, is the mechanism for opening the metal box 20. Because only opening RSP 32,34 can touch metal box 20, so the following chapters describe Figure 3A The 200 mm RSP pod opener 42 shown in FIG. ...

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Abstract

A two stage opener (50) for an EUV RSP (32, 34) includes an outer RSP pod opener (42, 44) having: 1. a RSP latch mechanism (42rlm) for latching a sealed outer RSP pod (32, 34) in place on the RSP pod opener (42, 44); and 2. a RSP lock / unlock mechanism (42lulm) for unlocking the RSP pod (32, 34) so the RSP pod opener (42, 44) can separate a RSP pod cover (32c, 343c) from a RSP pod door (32d, 34d). After the RSP lock / unlock mechanism (42lulm) unlocks the RSP pod (32, 34), the RSP pod opener (42, 44) separates the RSP pod door (32d, 34d) from the RSP pod cover (32c, 34c) thereby exposing a metal case (20). The pod opener (50) also includes a metal case opener (52) having at least two (2) arms (56) for receiving and supporting the metal case cover (22) while the two stage pod opener (50) separates the metal case base (24) from the metal case cover (22) thereby exposing the bare reticle (26) carried om the metal case base (24).

Description

technical field [0001] The present invention generally belongs to the technical field of exposure process equipment, in particular, it is a switch for loading an exposure mask box. Background technique [0002] As semiconductor linewidths continue to shrink below 22nm, circuit printing lithography tools can no longer use traditional reticles covered by a film (as do the well-known reticle). When using an extreme ultraviolet light source (EUV), which is necessary for printing lithographic patterns on products with linewidths below 22nm, the film can distort and / or absorb light, reducing image quality. To avoid pattern distortion, exposing a lithographic pattern with a line width below 22 nm requires the following two conditions: [0003] 1. EUV light source; [0004] 2. A bare glass mask. [0005] Previously, the use of a protective film has critically prevented particles from falling directly on the reticle patterned glass surface. Contamination of the patterned glass su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D85/00
CPCG03F1/66
Inventor K.C.吴
Owner SHANGHAI FORTREND TECH CO LTD
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