Substrate-based miniaturized artificial electromagnetic material and preparation method thereof
A technology of artificial electromagnetic materials and substrates, which can be used in electrical components, antennas, etc., and can solve the problems of large size and inability to put into practical applications.
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Embodiment 1
[0043] refer to figure 1 , the miniaturized artificial electromagnetic material based on a layer of substrate in the present invention is composed of N structural units arranged in parallel and equidistantly bonded, N≥2, and the structure of each structural unit is as follows figure 1 shown.
[0044] refer to figure 1 , the structural unit of the present invention comprises a dielectric substrate layer 1, the two sides of the dielectric substrate layer are equally etched rectangular broken lines; The bottom end of the rectangular fold line is connected, and the metal layer 2 coated on the other end of the dielectric substrate is connected to the top of the rectangular fold line on the other side of the dielectric substrate layer 1; N units, N≥2, are parallelized with the length of the overall substrate of the unit as a period Equidistantly arranged and bonded to obtain artificial electromagnetic material blocks.
[0045] refer to figure 2 , the invention makes figure 1 A...
Embodiment 2
[0051] The miniaturized artificial electromagnetic material based on a layer of substrate in the present invention is composed of N structural units arranged in parallel and equidistantly bonded, N≥2, and the structure of each structural unit is as follows image 3 shown.
[0052] refer to image 3 , the structural unit of the present invention includes a dielectric substrate layer 1, one side of the dielectric substrate layer 1 is etched with a rectangular folded line, the other side is etched with a plane spiral, and the center of the spiral is connected with a circular metal patch 3; both ends of the dielectric substrate are coated with a metal layer 2. The metal layer 2 coated on one end of the dielectric substrate is connected to the bottom end of the rectangular fold line on the dielectric substrate layer 1, and the metal layer 2 coated on the other end of the dielectric substrate is connected to the top end of the rectangular fold line on the dielectric substrate layer ...
Embodiment 3
[0055] In the first step, the thickness is selected to be 0.2mm, and the dielectric constant ε r =2.6±0.05, loss tangent tanδ=0.015 PTFE double-sided PCB copper-clad laminate, etched on the surface of one copper-clad foil as Figure 5 Rectangular fold line shown, etch on another copper clad surface as Image 6 As shown in the planar spiral line, a dielectric substrate layer with one side as a folded line surface and the other side as a helical surface is obtained; Figure 5 The length L of the middle rectangle polyline m =0.99L, width H m =0.99H, horizontal line width L of rectangular polyline wm =1.15×10 -2 L, the vertical line width L of the rectangular polyline wm =7.7×10 -3 L, line spacing S wm =7.7×10 -3 L; Image 6 The outer contour length L of the mid-plane helix p =0.92L, outer contour width H p =0.92H, number of turns n=13, line width L wp =8.1×10 -3 L, line spacing is S wp =1.23×10 -2 L, the radius of the circular metal patch connected to the center of...
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Abstract
Description
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Application Information
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