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Zinc oxide (ZnO)-transistor-coupled logic (TCL) semiconductor luminescent device and method for manufacturing same

A light-emitting device and semiconductor technology, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., to achieve the effects of ensuring integrity, suppressing lateral corrosion, and stable and reliable devices

Active Publication Date: 2015-02-18
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ITO materials have the following disadvantages: (1) In is a rare metal, its reserves and output are limited, and the cost is high; (2) In is toxic, it is a heavy metal element and will pollute the environment; (3) ITO Poor stability in reducing atmosphere
For ZnO-based transparent conductive films, the wet controllable etching process has always been a problem, mainly because ZnO is an amphoteric oxide, which reacts too strongly with acid and alkali, and the lateral corrosion is serious, which affects the etching accuracy and etching speed. fast, hard to control
However, the cost of dry etching process, such as ICP etching, etc., is too high, which is the main challenge for the manufacture and popularization of ZnO-TCL light-emitting diode devices.

Method used

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  • Zinc oxide (ZnO)-transistor-coupled logic (TCL) semiconductor luminescent device and method for manufacturing same
  • Zinc oxide (ZnO)-transistor-coupled logic (TCL) semiconductor luminescent device and method for manufacturing same
  • Zinc oxide (ZnO)-transistor-coupled logic (TCL) semiconductor luminescent device and method for manufacturing same

Examples

Experimental program
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Effect test

Embodiment 1

[0026] like figure 1 As shown, a semiconductor light-emitting device, which includes: a substrate 1 and a semiconductor epitaxial stack grown on the substrate, the semiconductor epitaxial stack includes: N-type layer 2, MQWS layer 3, P type layer 4 and ZnO-TCL layer 5; after etching, an N-type metal electrode 6 is evaporated on the upper surface of the N-type layer 2; a P-type metal electrode 7 is evaporated on the ZnO-TCL layer 5, and the P-type metal electrode The electrode 7 includes an embedded portion 71 embedded into the ZnO-TCL layer, and the embedded portion 71 has an embedded depth smaller than the height of the ZnO-TCL layer.

[0027] The cross section of the embedded part of the P-type metal electrode 7 is trapezoidal or bowl-shaped.

[0028] The P-type metal electrode 7 includes a protruding portion 72 placed on the upper surface of the embedded portion 71 , and the protruding portion 72 protrudes from the upper surface of the ZnO—TCL layer.

[0029] The ZnO-TCL...

Embodiment 2

[0045] Present embodiment is except following feature, and other is all identical with embodiment 1: as figure 2 As shown, in order to reduce the operating voltage of the device more effectively, its ZnO-TCL layer 5 adopts a stacked structure ZnO:Al5.2 / ZnO:Ga5.1 / ZnO:Al5.2; and defines the P-type metal electrode 7 area When patterning, use a certain proportion of glacial acetic acid and water to perform wet etching to etch the ZnO-TCL layer 5 to the ZnO:Ga layer 5.1.

Embodiment 3

[0047] Present embodiment is except following feature, and other is all identical with embodiment 1: as image 3 As shown, in order to reduce the operating voltage of the device more effectively and improve the light extraction efficiency of the device in this embodiment, the ZnO-TCL layer 5 adopts a stacked structure ZnO: Ga5.1 / ZnO5.3, and the growth process is changed by changing the growth Process parameters, so that the ZnO layer 5.3 presents a nanowire structure; when defining the region and pattern of the P-type metal electrode 7, use a certain proportion of glacial acetic acid and water to perform wet etching to etch the ZnO-TCL layer 5 to the ZnO:Ga layer 5.1 .

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Abstract

The invention discloses a zinc oxide (ZnO)-transistor-coupled logic (TCL) semiconductor luminescent device and a method for manufacturing the same. The ZnO-TCL semiconductor luminescent device comprises a substrate and a semiconductor epitaxy laminate grown on the substrate; the semiconductor epitaxy laminate comprises an N-type layer, a multi-quantum wells (MQWS) layer, a P-type layer and a ZnO-TCL layer from bottom to top sequentially; after wet etching, an N-type metal electrode is also evaporated on the upper surface of the N-type layer; a P-type metal electrode is evaporated on the ZnO-TCL layer and comprises an embedded part; the embedded part is embedded in the ZnO-TCL layer; and the embedded depth of the embedded part is smaller than the height of the ZnO-TCL layer. A weak acid wet etching process is adopted, and controllable high-precision and low-cost etching is realized; a part of ZnO-TCL layer is etched off, so that the section of the ZnO-TCL layer is trapezoidal or bowl-shaped, a surface, which contacts the evaporated electrode, of the ZnO-TCL layer is wide, and adhesive force is high; and because part of ZnO-TCL layer is kept, integrity of a current expanding layer is guaranteed, and a current expanding effect can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor light emitting devices, in particular to a ZnO-TCL semiconductor light emitting device and a manufacturing method thereof. Background technique [0002] The invention is carried out aiming at ZnO-TCL process technology, one of the current research hotspots of GaN-based light-emitting diodes. The realization of the performance of power GaN-based light-emitting diodes is mainly divided into three aspects. First, grow high-quality GaN-based light-emitting diode epitaxial structures, which determine the internal quantum efficiency of light-emitting diodes; second, light extraction technology, which is to improve An important technology for the external quantum efficiency and reliability of the device; the preparation technology of transparent conductive film with high conductivity and high light transmittance is one of the effective ways to improve the light extraction of light-emitting diodes;...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/38H01L33/42
Inventor 裴艳丽吴锦壁江灏范冰丰王钢
Owner SUN YAT SEN UNIV
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