Phenyl modified epoxy organic silicon resin and preparation method thereof, organic silicon packaging adhesive and LED lamp

A technology of epoxy silicone and silicone, which is applied in adhesives, electrical components, circuits, etc., can solve the problems of short LED life, high production cost, poor bonding performance and high temperature resistance, etc., and achieve long lamp life, optical The effect of stable performance, excellent high temperature resistance and bonding performance

Inactive Publication Date: 2012-12-05
方舟(佛冈)化学材料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the bonding performance and high temperature resistance of this silicone encapsulant are poor, and the production cost is high
After it is packaged with a high-power LED, the life of the LED is short,

Method used

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  • Phenyl modified epoxy organic silicon resin and preparation method thereof, organic silicon packaging adhesive and LED lamp
  • Phenyl modified epoxy organic silicon resin and preparation method thereof, organic silicon packaging adhesive and LED lamp
  • Phenyl modified epoxy organic silicon resin and preparation method thereof, organic silicon packaging adhesive and LED lamp

Examples

Experimental program
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preparation example Construction

[0046] Correspondingly, the present invention also provides a preparation method of the above-mentioned phenyl-modified epoxy silicone resin. The process flow of this method is as figure 1 shown, including the following steps:

[0047] Step S01. Configure the mixed solution of monomers: the epoxy group-containing alkyl silicon monomer of the general molecular formula A, the methyl phenyl silicon monomer of the general formula B and the methyl silicon monomer of the general formula C are as follows: The percentage is mixed to form a mixed solution:

[0048] Epoxy-containing alkyl silicon monomer 10-90%

[0049] Methylphenyl silicon monomer 10~90%

[0050] Methyl silicon monomer 0~40%,

[0051] , , ,

[0052] Among them, the adjacent or non-adjacent R in the formulas A, B, and C can be the same or not the same as CH 3 or C 2 h 5 or OCH 3 or OC 2 h 5 ;

[0053] Step S02. Polymerize the mixture of monomers: in an oxygen-free environment, mix the mixture pre...

Embodiment 1

[0094] Phenyl modified epoxy silicone resin and preparation method thereof:

[0095] Step 1. Obtain reactant monomer:

[0096] 2-(3,4-Epoxycyclohexyl)ethyltrimethoxysilane: self-made according to the existing method, purify it: distill it, take the middle fraction (head and tail removed), the purity is 99.7% about;

[0097] 2-(3,4-Epoxycyclohexyl)ethylmethyldimethoxysilane: buy it directly, purify it: distill it, take the middle distillate (head and tail off), the purity is 99.8% about;

[0098] Dimethyldimethoxysilane: self-made according to the existing method, purify it: distill it, take the middle distillate (head and tail removed), the purity is about 99.5%;

[0099] Methylphenyldimethoxysilane: self-made according to the existing method, purify it: distill it, take the middle distillate (head and tail removed), the purity is about 99.8%;

[0100] Trimethylmethoxysilane: buy it directly, purify it: distill it, take the middle distillate (head and tail removed), the pu...

Embodiment 2

[0110] Phenyl modified epoxy silicone resin and preparation method thereof:

[0111] Step 1. Obtain reactant monomer:

[0112] 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane: buy it directly, purify it: distill it, take the middle fraction (head and tail removed), the purity is about 99.7%;

[0113] 2-(3,4-Epoxycyclohexyl)ethylmethyldimethoxysilane: buy it directly, purify it: distill it, take the middle distillate (head and tail off), the purity is 99.8% about;

[0114] Dimethyldimethoxysilane: buy it directly, purify it: distill it, take the middle distillate (head and tail removed), the purity is about 99.5%;

[0115] Methylphenyldimethoxysilane: buy it directly, purify it: distill it, take the middle distillate (head and tail removed), the purity is about 99.8%;

[0116] Trimethylmethoxysilane: buy it directly, purify it: distill it, take the middle distillate (head and tail removed), the purity is about 99.2%;

[0117] Methyltrimethoxysilane: buy it directly, purify it:...

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Abstract

The invention discloses a phenyl modified epoxy organic silicon resin and a preparation method thereof, an organic silicon packaging adhesive and an LED lamp. A molecular structure of the phenyl modified epoxy organic silicon resin is as shown in a general formula 1 in the specification; and in the general formula 1, R1 is CH3 or CH6H5, R2 is CH3 or a repeating chain a, R3 is CH3, C6H5 or the repeating chain a, and R4 is CH3 or C6H5, wherein a is 1-7, b is 0-3, c is 1-4 and n is 1-20. The preparation method comprises the steps as follows: configuring a monomer mixing solution; and carrying out polymerization reaction on the monomer mixing solution. The organic silicon packaging adhesive contains the phenyl modified epoxy organic silicon resin. The LED lamp is packaged by the organic silicon packaging adhesive. The phenyl modified epoxy organic silicon resin has the advantages of excellent high temperature resistance and bond performance due to phenyl groups and epoxy groups.

Description

technical field [0001] The invention belongs to the technical field of LEDs, and in particular relates to a phenyl-modified epoxy silicone resin and a preparation method thereof, a silicone packaging glue and an LED lamp. Background technique [0002] Light-emitting diode (LIGHT EMITTING DIODE referred to as LED) is a type of electroluminescent solid-state device. Compared with traditional light sources, LED has the advantages of small working current, environmental protection, simple structure, high brightness, small size, and long service life. With the continuous progress of LED research, high-power LED production has become a fact. [0003] In the LED illuminant structure, in addition to the LED chip, its filling material is also one of the important factors that determine whether it can be used in actual production and life. Especially the emergence of white high-power LEDs, due to their small size, high power, high brightness, and long service life, more stringent op...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/14C09J183/06H01L33/56
Inventor 徐剑王小妹张晨光
Owner 方舟(佛冈)化学材料有限公司
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