Dry preparation method of high-temperature resistant nanometer micropore thermal insulation board

Abstract

The invention discloses a dry preparation method of a high-temperature resistant nanometer micropore thermal insulation board. The dry preparation method comprises the following steps of: (1) weighting nanometer fumed silica, an infrared radiation light screening agent and reinforced fibers proportionally, and stirring and dispersing into a stirring and dispersing device to obtain a mixture; (2) feeding the mixture into a mould of a press; (3) pressing the mixture in the mould to a core at the pressure intensity of 0.3-2 MPa; and (4) coating the core into a packaging material. The dry preparation method, provided by the invention, has the advantages of ultra-thin high-temperature resistant nanometer micropore thermal insulation board, low heat conduction coefficient, good high-temperature resistance, low heating permanent line change coefficient and the like.

Description

technical field [0001] The invention relates to the technical field of heat insulation board preparation, in particular to a dry method for preparing a high temperature resistant nano microporous heat insulation board. Background technique [0002] At present, industrial kilns, ladles, metal smelting and other fields consume a lot of energy. Therefore, from the perspective of energy saving and emission reduction, it is necessary to carry out efficient heat insulation for equipment to reduce energy consumption and demand. Although the existing high-temperature-resistant insulation boards can withstand high temperatures of 1000 degrees Celsius or above, their thermal conductivity is high and their thermal insulation performance is not good enough, such as calcium silicate boards, ceramic fiber boards, etc.; while traditional super insulation materials such as vacuum insulation Although the thermal insulation performance of plates and aerogels is very good and can reach a therm...

AI Technical Summary

Problems solved by technology

Although the existing high-temperature-resistant insulation boards can withstand high temperatures of 1000 degrees Celsius or above, their thermal conductivity is high and their thermal insulation performance is not good enough, such as calcium silicate boards, ceramic fiber boards, etc.; while traditional super insulation materials such as vacuum insulation Although the thermal insulation performance of plates and aerogels is very good and can reach a thermal conductivity of about 0.005W / (m K), but because the radiation heat conduction will rise sharply at high temperatures, and the vacuum layer will be destroyed and lose the effect of vacuum insulation. Therefore, its thermal insulation performance is very good but it is not resistant to high temperature; in addition, the fiber structure of ordinary nano-microporous heat insulation panels cannot withstand high temperatures, and the fiber structure layer will be pulverized above 500 degrees Celsius, and the plate structure will be significantly damaged

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