Diamond recovery method for resin diamond scroll saw

A technology of diamond wire saw and recycling method, applied in the field of diamond recycling of resin diamond wire saw, can solve the problems of polluted environment, unsuitable environmental protection requirements, and high injury to operators

Active Publication Date: 2013-01-02
南通江涌投资开发有限公司
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

However, the recovery of concentrated acid not only causes high harm to the operators, but also discharges the treated waste into the environment, polluting the environment.
It can be seen that the existing recycling methods are not suitable for today's environmental protection requirements

Method used

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  • Diamond recovery method for resin diamond scroll saw
  • Diamond recovery method for resin diamond scroll saw
  • Diamond recovery method for resin diamond scroll saw

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Embodiment Construction

[0017] In the prior art, diamonds from resin diamond wire saws are recovered by means of concentrated acid treatment, which not only causes harm to the operators themselves, but also pollutes the environment. It can be seen that the existing recycling methods cannot meet today's environmental protection needs. The embodiment of the present invention provides a diamond recovery method for resin diamond wire saws, which effectively solves the problems in the prior art by physically recovering diamonds on the wire saws. The method includes:

[0018] High temperature treatment of resin diamond wire saw;

[0019] Place the high temperature treated resin diamond wire saw in water at a preset temperature for quenching treatment;

[0020] Ultrasonic treatment is carried out on the resin diamond wire saw placed in water to obtain the abrasive layer material of the resin diamond wire saw;

[0021] performing solid-liquid separation on the abrasive layer material, and performing dryin...

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Abstract

The invention discloses a diamond recovery method for a resin diamond scroll saw. The method includes subjecting the resin diamond scroll saw to a high-temperature processing; placing the processed resin diamond scroll saw into water with a preset temperature and performing quenching; subjecting the resin diamond scroll saw placed in the water to an ultrasonic processing to obtain abrasive layer materials of the resin diamond scroll saw; subjecting the abrasive layer materials to solid-liquid separation and drying processing to obtain a solid mixture of the abrasive layer materials; and separating the solid mixture to obtain diamond particles. In the scheme, physical treatment methods such as high temperature, quenching and ultrasonic mode are used for recovering the diamond particles, and the recovery of the diamond particles is achieved in an environment-friendly mode.

Description

technical field [0001] The invention relates to the technical field of silicon wafer cutting, in particular to a diamond recycling method used in a resin diamond wire saw. Background technique [0002] With the rapid development of the solar energy industry, silicon wafer cutting technology has developed from inner circle cutting to wire cutting. The wire cutting has developed from the wire cutting of free abrasives to the wire cutting of fixed abrasives. Among them, wire cutting with fixed abrasives generally attaches diamonds to steel wires by means of electroplating or resin bonding. Usually, diamond wire saws bonded by resin are called resin diamond wire saws. Resin diamond wire saw generally includes: steel wire, abrasive layer. Wherein, the abrasive layer is the material wrapped outside the steel wire, including diamond, resin, and filler. The filler can be silica or alumina and other substances, which are used to improve the bonding performance. [0003] For the ...

Claims

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Application Information

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IPC IPC(8): B28D5/04C01B31/00C01B32/28
Inventor 何建霞鲁战锋刘伟
Owner 南通江涌投资开发有限公司
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