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Polyamic acid resin and polyimide resin purification method

A technology of polyamic acid resin and polyimide resin, which is applied in the field of purification of resin solution, and can solve problems such as complex process procedures and large amount of solvent

Active Publication Date: 2013-01-02
DAXIN MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the amount of solvent consumed by using this method in the industrial process will be quite large, and further cause problems in the subsequent waste liquid treatment
In addition, the manufacturing process is also more complicated

Method used

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  • Polyamic acid resin and polyimide resin purification method
  • Polyamic acid resin and polyimide resin purification method
  • Polyamic acid resin and polyimide resin purification method

Examples

Experimental program
Comparison scheme
Effect test

experiment example 1

[0044] Firstly, PI resin (or PAA resin) containing metal ion impurities and ion exchange resin ( 50W series; Monosphere series; Marathon; series; series) for mixing, the usage ratio is 1wt% ~ 50wt% relative weight ratio, and stir evenly at 15°C ~ 20°C so that the PI resin can be fully mixed with the ion exchange resin, and then 2kg / m 2 The inert gas pushes the liquid through a 300 mesh (mesh) filter plate to separate the ion exchange resin and PI resin, and then add the PI resin to the reaction kettle for vacuum distillation at 15 ° C ~ 65 ° C / 0.1 Torr ~ 5 Torr , Take a sample every 4 hours to detect the moisture content until the moisture content reaches below 0.1%.

experiment example 2

[0046] Firstly, PI resin (or PAA resin) containing metal ion impurities and ion exchange resin ( 50W series; Monosphere series; Marathon; series; series) for mixing, the usage ratio is 50wt%-80wt% relative weight ratio, and mix at 20°C-25°C, stir evenly so that the PI resin can be fully mixed with the ion exchange resin, and then use 2kg / m 2 The inert gas pushes the liquid through a 300 mesh (mesh) filter plate to separate the ion exchange resin and PI resin, and then add the PI resin to a thin film evaporator at 150rpm with a speed of 0°C to 65°C / 0.01 torr to 2 torr Concentrate, and check the water content every time it passes through the device and takes a sample. If it does not meet the specification, it will be repeatedly fed into the thin film evaporator until the water content reaches below 0.1%.

experiment example 3

[0048] The ion exchange resin ( 50W series; Monosphere series; Marathon; series; series) mixed and filled at 20℃~25℃ to the bottom of the pressure vessel supported by a 300-mesh filter plate, and the PI resin containing metal ion impurities was mixed at 2kg / m 2 ~4kg / m 2 Nitrogen is transported through the packed tower and fully mixed with the ion exchange resin at a flow rate of 30L / h~120L / h, and then the PI resin (or PAA resin) is added to the reactor at 15°C~65°C / 0.1 Torr~5 Torr Vacuum distillation, sampling once every 4 hours for moisture content testing until the moisture content reaches below 0.1%.

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Abstract

The invention provides a polyamic acid resin and polyimide resin purification method. The polyamic acid resin purification method includes providing polyamic acid resin containing metal ion impurity, and then using cation exchange resin to contact the polyamic acid resin, to remove metal ions therein, after that, removing water in the polyamic acid resin, for purification of polyamic acid resin.

Description

technical field [0001] The present invention relates to a purification method of a resin solution, and in particular to a purification method of polyamic acid (PAA) resin and polyimide resin. Background technique [0002] The performance of electronic material products on the application side often determines the quality and performance of components. Therefore, compared with generally widely used materials, electronic materials have higher threshold requirements for purity and quality. In the synthesis of electronic materials, in order to meet the needs of end products, most of them are formulated by polymerizing various raw materials or adding different materials. Therefore, if the purity of the most upstream raw materials can be controlled, it can be reduced. Changes in the quality of electronic materials. [0003] Polyimide (PI) and polyamic acid (PAA) are widely used in electronic materials, such as LCD, IC, flexible copper clad laminate (FCCL) and other electronic pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10
Inventor 蔡明睿
Owner DAXIN MATERIALS
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