A high-efficiency nano-insulation board for thermal equipment and its manufacturing method

A manufacturing method and a technology for insulating panels, which are applied to heat exchange equipment, mechanical equipment, and pipelines through thermal insulation protection, etc., can solve the problems of increased thermal conductivity and low thermal conductivity, and achieve high mechanical strength, convenient construction, and easy molding. Effect

Active Publication Date: 2016-03-02
孟占营
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AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a low thermal conductivity, which solves the problem that the thermal conductivity increases with the increase of density when producing insulation materials.

Method used

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Embodiment 1

[0018] In this embodiment, a high-efficiency nano-insulation board and its manufacturing method are firstly mixed with fumed silica particles, nano-zirconia, and inorganic fibers by weight percentage of 30-60%, 30-65%, and 1-5% Stirring, wherein the inorganic fibers are alumina fibers and polycrystalline mullite fibers; the alumina fibers and polycrystalline mullite fibers are evenly dispersed in the nanoparticles, and the mixed powdery mixture is placed on a press to form, that is It can obtain high mechanical strength (compression 10% 3.0Mpa), excellent thermal insulation performance (thermal conductivity is 0.05W / M.K when the hot surface is 800 degrees), a complete structure without cracks, and a smooth surface nano-insulation block; The blocks of heat-insulating blocks are encapsulated with PE film, and then heat-shrinked. The PE film is a heat-shrinkable film, and a nano-insulated block that is moisture-proof, waterproof, and powder-free can be obtained; finally, the block...

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Abstract

The invention relates to the field of thermal-insulation boards, and discloses an efficient nanometer thermal-insulation board for thermal equipment, and a manufacturing method of the efficient nanometer thermal-insulation board. The efficient nanometer thermal-insulation board comprises the nanoscale gas-phase white carbon black particles and nanoscale zirconium oxide and inorganic fiber, the production process comprises the steps of: mixing the white carbon black, zirconium oxide and inorganic fiber according to certain proportion, and conducting compression moulding; packaging by using a PE film; and covering the sides A and B of the board by using pressure-senstive adhesive tape, thus obtaining a structure with nanometer holes. The efficient nanometer thermal-insulation board has the characteristics of being high in mechanical strength, low in thermal conductivity, pollution-free, convenient to construct and use, and the like. The invention discloses a fire-resistant and heat-insulation efficient nanometer thermal-insulation board which is used for high-temperature thermal equipment such as a high-temperature kiln, a steel ladle, a tundish, a hot-metal ladle, a heating furnace and a converter.

Description

technical field [0001] The invention relates to the field of heat insulation boards, in particular to a high-efficiency nano heat insulation board for thermal equipment and a manufacturing method thereof. Background technique [0002] Although the lead silicate insulation materials, calcium silicate insulation materials and airgel nano insulation materials currently on the market have good insulation performance at room temperature, they are prone to pulverization during long-term use at high temperatures. In thermal equipment, when the temperature is higher than 500°C, the thermal conductivity will increase, the mechanical strength will be poor, it will break when touched, and it will easily drop powder. It is easy to cause environmental pollution during use. And as the density increases, the thermal conductivity will increase, which limits the application places. Contents of the invention [0003] The purpose of the present invention is to provide a low thermal conduct...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F16L59/02
Inventor 孟占营
Owner 孟占营
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