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Test method of adhesive removing amount

A test method and glue amount technology, applied in the field of glue removal test, can solve problems such as excessive glue removal, large test error, and large data volatility, so as to improve the qualified rate of finished products, reduce material consumption, and data fluctuations small effect

Inactive Publication Date: 2015-07-22
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] Using the above-mentioned glue removal test method, the test glue removal amount is the removal amount of the resin on the entire board surface of the resin sheet surface layer, which is related to the actual situation of the drilling dirt and glue residue on the hole wall of the PCB glue removal process. Inconsistent, and did not take into account the impact of the drilling process on the amount of glue removed
However, in fact, the drilling process has a huge impact on the amount of glue removed. Therefore, when using this method to monitor the glue removal process, although the amount of glue removed is within the control range, there are also certain small percentages that are caused by Unqualified finished products caused by excessive glue removal or small amount of glue removal
[0014] In addition, this existing method is used to test the amount of glue removed. The weight difference before and after the glue removal is very small, generally only 0.05%-1%. During the operation process, it is easy to be touched, scratched, etc., and the substrate resin will drop, resulting in large data fluctuations and large test errors.

Method used

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  • Test method of adhesive removing amount
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  • Test method of adhesive removing amount

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] Prepare the copper clad substrate S1141 sample of Guangdong Shengyi Technology Co., Ltd., specification: 1.601 / 1, sample size: length 10cm, width 10cm, substrate thickness excluding copper foil is 1.60mm;

[0068] Drill holes in the sample thickness direction: 120x130 through holes with a diameter of 0.03cm and 20 through holes with a diameter of 0.1cm;

[0069] The drilled sample is baked at 150°C / 0.5hr, and then weighed as W1=33.223g;

[0070] Degumming is performed on the sample after drilling and baking, and then taken out to obtain a bare board sample;

[0071] The bare board sample obtained after degumming was baked at 150°C / 0.5hr, and then weighed as W2=33.083g;

[0072] Calculate glue removal amount: (W1-W2) / A=(33.223-33.083)×1000 / (120x 130xπx0.03x0.16+20×πx0.1×0.16+10x0.16x4)

[0073] =0.58mg / cm 2 .

Embodiment 2

[0075] Prepare the copper clad substrate S1141 sample of Guangdong Shengyi Technology Co., Ltd., specification: 1.601 / 1, sample size: length 10cm, width 10cm, substrate thickness excluding copper foil is 1.60mm;

[0076] Drill holes through the thickness of the sample, including:

[0077] Large hole area: (P is hole center distance)

[0078] φ2.0mm, P=4.0mm, 10 holes, 2 rows;

[0079] φ3.0mm, P=5.0mm, 8 holes, 2 rows;

[0080] φ4.0mm, P=6.0mm, 6 holes, 2 rows;

[0081] φ5.0mm, P=7.0mm, 5 holes, 2 rows;

[0082] Irregular hole area:

[0083] φ1.0×5.0, P=10.0mm, 4 holes, 2 rows;

[0084] φ1.6×6.4, P=10.0mm, 4 holes, 2 rows;

[0085] φ2.0×7.5, P=10.0mm, 4 holes, 2 rows;

[0086] Dense hole area:

[0087] φ0.25mm, P=0.50mm, 10×10 holes, 2 rows;

[0088] φ0.25mm, P=0.65mm, 10×10 holes, 2 rows;

[0089] φ0.30mm, P=0.80mm, 10×10 holes, 2 rows;

[0090] φ0.30mm, P=1.00mm, 10×10 holes, 2 rows;

[0091] φ0.30mm, P=1.20mm, 10×10 holes, 2 rows;

[0092] Hole area:

[0093] φ...

example 1

[0110] Take the copper clad substrate sheet (Guangdong Shengyi Technology Co., Ltd., model: S1141, specification: 1.601 / 1) to make samples 1~7 and samples 8~14 respectively, and adopt the test method of glue removal amount of the present invention (drilling hole→baking weighing→glue removal→baking weighing→calculation of glue removal) and the existing test method of glue removal (etching→baking weighing→glue removal→baking weighing→calculation of glue removal ), the glue removal test was carried out in a PCB factory at the same time, and the comparison of the test results of the glue removal amount is shown in Table 1 below:

[0111] Table 1. Adhesive Removal Amounts for Samples 1-7 and Samples 8-14

[0112]

[0113] Among them, the samples are made as follows:

[0114]

[0115] Among them, the drilling parameters are as follows:

[0116] drill bit suppliers

Jinzhou Diamond

The newness of the drill bit

New Diamond

Parameters: falling spee...

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Abstract

The invention provides a test method of the adhesive removing amount. The method comprises the following steps: (1) preparing a copper foil cladding substrate sample; (2) drilling a certain amount of holes in the thickness direction of the sample; (3) baking the sample drilled with holes and weighing the samples to be W1; (4) removing the adhesive of the sample subjected to drilling and baking, and taking the sample out; (5) baking the sample subjected to adhesive removal and weighing the sample to be W2; and (6) calculating the adhesive removing amount to be (W1-W2) / A, wherein A is the total area of the base material area uncovered by the copper foil after the sample is drilled, and the area of the naked resin in the hole and the area of the naked resin on the peripheral side of the sample are included. The test method of the adhesive removing amount has the advantages of less test error, less data fluctuation and accurate test result.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacture, in particular to a method for testing the amount of glue removed. Background technique [0002] In the process of through-hole processing of double-sided and multi-layer PCB boards, in order to remove the drilling dirt and slag on the hole wall of the through-hole, the drilling dirt removal process is generally used after drilling and before PTH (also known as copper sinking). This is what the industry calls the "desmear" process. Chen Zhidong et al. mentioned in "Methods of Drilling Stain Removal" that the methods for removing the drilling smear on the wall of the through hole include concentrated sulfuric acid method, chromic acid method, plasma method and alkaline permanganate method. At present, the alkaline permanganate method is mainly used in the PCB industry, which mainly includes the following three processes: (1) swelling, (2) roughening, which is often called "degummin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N5/04
Inventor 李龙飞邹强陈伟杰郑军于平
Owner GUANGDONG SHENGYI SCI TECH