Integrating method for high-sensitivity temperature-controlled thick film hybrid integrated circuit

Abstract

The invention discloses an integrating method for a high-sensitivity temperature-controlled thick film hybrid integrated circuit. The method comprises the steps of: printing and forming a thick film resistor, a metal conduction band and a metallic bonding area by using a screen printing method; printing and forming a thick film thermistor by using the screen printing method again; forming a thick film insulating medium layer and a thick film metalization layer which is required by sticking of chips on a thermistor thick film by using the same method; and directly installing and sticking a thermosensitive sensing signal treating chip, a temperature control device main chip, other active or passive elements and the like on a thick film base pipe by using a commonly hybrid integrated circuit assembling process, then performing bonding by using bonding wires, and finally sealing a pipe base and a pipe cap under a special atmosphere, so as to obtain a high-sensitivity temperature-controlled thick film hybrid integrated circuit device. According to the method, the thick film thermistor and the temperature control device main chip are in gapless atom contact in the maximum contact area, heat of the main chip can be fast transferred to the thermistor to the maximum degree, so as to realize high-sensitivity temperature-control.

Description

technical field [0001] The invention relates to an integrated circuit, in particular to a high-sensitivity temperature-controlled thick-film hybrid integrated circuit. Background technique [0002] In the original temperature-controllable hybrid circuit integration technology, two-dimensional planar integration technology is used on the hybrid integration surface of the temperature-controllable integrated circuit, and the separated thermal chip resistor, thermal sensor signal processing chip, temperature control The main chip of the device, other active or passive components, etc. are directly mounted on the thick film substrate, and then bonded with bonding wire (gold wire or silicon-aluminum wire) to complete the entire electrical connection, and finally in a specific atmosphere It is made by sealing the tube base and the tube cap. Due to the use of two-dimensional planar integration technology in the original technology, there will inevitably be a gap between the tempera...

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But this integrated circuit is not a high-sensitivity temperature-controlled hybrid integrated circuit

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