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Integral packaged intelligent healthcare LED area light source

An LED surface light source, intelligent technology, applied in the field of semiconductor LED overall package surface light source, can solve the problems of low working voltage, low power consumption, complex process and so on

Inactive Publication Date: 2013-01-30
苑润东
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Semiconductor light-emitting diode (LED) light source has the advantages of low working voltage, low power consumption, high luminous efficiency, stable and reliable performance, pure light color, non-toxic and harmless, etc., and has been accepted by the majority of people, but this light source is a point light source. The process is complex, the cost is high, the effect is poor, and it is not conducive to widespread promotion

Method used

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  • Integral packaged intelligent healthcare LED area light source

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Embodiment Construction

[0005] Such as figure 1 As shown, an integrally packaged LED lamp tube of the present invention is composed of an integrally packaged support 1, a chipset board 2, a package layer 3, a light-emitting surface 10, and an intelligent driver 4. There is a packaging cavity 5 on the integrally packaged support 1, and the packaged cavity The inner surface 6 of 5 can be a slope or a vertical surface, which is a smooth surface or a mirror surface; the chipset board 2 is installed in the bottom chipset board mounting groove 8 of the package cavity 5, and a layer of uniform light glue 7 is coated on it, and then coated Or cover a layer of encapsulation layer 3; one end of the intelligent driver 4 is connected to high-voltage alternating current and the other end is constant current to output direct current to drive the LED light source, and the output current of the intelligent driver 4 is changed to adjust the light by detecting indoor light and different people living and working indoor...

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Abstract

The invention discloses an integral packaged intelligent healthcare LED area light source which comprises a packaging support, a chip assembly plate, a packaging layer and an intelligent driver. A packaging cavity is arranged on the packaging support, the inner surface of the packaging cavity can be an oblique plane or an upright plane, one end of the intelligent driver is connected with a high-voltage alternating-current source, the other end of the intelligent driver outputs direct-current electricity to drive an LED light source, and the intelligent driver can be mounted inside or outside the packaging support. The packaging support is integrally made of metal or nonmetal materials, the light source packaged by the packaging support is formed by one-step integral packaging, the packaging layer is made of a mixture of fluorescent powder A, diffusion powder B, red powder C and pouring sealants D, and light sources which has different colors, different color temperatures and different color rendering indexes can be manufactured by mixing the fluorescent powder A, the diffusion powder B, the red powder C and the pouring sealants D according to different proportions.

Description

technical field [0001] The invention relates to a lamp tube light source, in particular to a semiconductor LED integrally packaged surface light source. Background technique [0002] Semiconductor light-emitting diode (LED) light source has the advantages of low working voltage, low power consumption, high luminous efficiency, stable and reliable performance, pure light color, non-toxic and harmless, etc., and has been accepted by the majority of people, but this light source is a point light source. The process is complicated, the cost is high, the color is single, and the effect is relatively poor, which is not conducive to widespread promotion. Contents of the invention [0003] The present invention is an integrally packaged intelligent health-care LED surface light source designed to improve the light efficiency of semiconductor LED light sources, simplify the production process, and improve work efficiency. There is a package cavity on the package bracket, and the i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V23/00F21V29/00H01L33/56F21Y101/02F21K9/238F21V29/74F21Y115/10
Inventor 苑润东苑泽
Owner 苑润东